SBOS622D July   2018  – May 2025 OPA855

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input and ESD Protection
      2. 8.3.2 Feedback Pin
      3. 8.3.3 Wide Gain-Bandwidth Product
      4. 8.3.4 Slew Rate and Output Stage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply and Single-Supply Operation
      2. 8.4.2 Power-Down Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TIA in an Optical Front-End System
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Optical Sensor Interface
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • Y|0
  • DSG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

OPA855 DSG Package,8-Pin WSON With Exposed Thermal Pad(Top View) Figure 5-1 DSG Package,
8-Pin WSON With Exposed Thermal Pad
(Top View)
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
FB 1 Input Feedback connection to output of amplifier
IN– 3 Input Inverting input
IN+ 4 Input Noninverting input
NC 2 — Do not connect
OUT 6 Output Amplifier output
PD 8 Input Power down connection. PD = logic low = power off mode; PD = logic high = normal operation.
VS– 5 — Negative voltage supply
VS+ 7 — Positive voltage supply
Thermal pad — Connect the thermal pad to VS–
Figure 5-2 Bare Die Package
Table 5-2 Bond Pad Functions
PAD TYPE DESCRIPTION
NAME NO.
FB 1 Input Feedback connection to output of amplifier
IN– 3 Input Inverting input
IN+ 4 Input Noninverting input
NC 2,5,6,13 — Do not connect
OUT 9 Output Amplifier output
PD 12 Input Power down connection. PD = logic low = power off mode; PD = logic high = normal operation.
VS– 7,8 — Negative voltage supply
VS+ 10,11 — Positive voltage supply
Backside — Connect to VS–
Table 5-3 Bare Die Information
DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION
381 μm Silicon with backgrind Wafer backside is electrically connected to VS– AlCu
Table 5-4 Bond Pad Coordinates of Bare Die Version in Microns
PAD NUMBER PAD NAME X-MIN Y-MIN X-MAX Y-MAX
1 FB 14.5 537.4 79.5 602.4
2 NC 14.5 379 79.5 444
3 IN– 14.5 227 79.5 292
4 IN+ 14.5 68.6 79.5 133.6
5 NC 296.725 34.825 361.725 99.825
6 NC 421.725 34.825 486.725 99.825
7 VS– 545.5 93.8 610.5 158.8
8 VS– 545.5 178.8 610.5 243.8
9 OUT 545.5 303 610.5 368
10 VS+ 545.5 427.2 610.5 492.2
11 VS+ 545.5 512.2 610.5 577.2
12 PD 421.325 571.175 486.325 636.175
13 NC 297.125 571.175 362.125 636.175