SBOS982E June   2020  – November 2021 OPA2863 , OPA4863 , OPA863

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: OPA863
    5. 7.5  Thermal Information: OPA2863
    6. 7.6  Thermal Information: OPA4863
    7. 7.7  Electrical Characteristics: 10 V
    8. 7.8  Electrical Characteristics: 3 V
    9. 7.9  Typical Characteristics: VS = 10 V
    10. 7.10 Typical Characteristics: VS = 3 V
    11. 7.11 Typical Characteristics: VS = 3 V to 10 V
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
        1. 8.3.2.1 Overload Power Limit
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Low-Side Current Sensing
      1. 9.2.1 Design Requirements
    3. 9.3 Front-End Gain and Filtering
    4. 9.4 Low-Power SAR ADC Driver and Reference Buffer
    5. 9.5 Variable Reference Generator Using MDAC
    6. 9.6 Clamp-On Ultrasonic Flow Meter
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information: OPA4863

THERMAL METRIC(1) OPA4863 UNIT
PW (TSSOP)
14 PINS
RθJA Junction-to-ambient thermal resistance 99.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 27.6 °C/W
RθJB Junction-to-board thermal resistance 56.1 °C/W
ΨJT Junction-to-top characterization parameter 4.4 °C/W
YJB Junction-to-board characterization parameter 55.3 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.