SBAS901C July   2018  – October 2020 REF34-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1. 6.1 Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
  8. 8 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Solder Heat Shift
    2. 9.2 Long-Term Stability
    3. 9.3 Thermal Hysteresis
    4. 9.4 Power Dissipation
    5. 9.5 Noise Performance
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Supply Voltage
      2. 10.3.2 Low Temperature Drift
      3. 10.3.3 Load Current
    4. 10.4 Device Functional Modes
      1. 10.4.1 EN Pin
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Basic Voltage Reference Connection
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
          1. 11.2.1.2.1 Input and Output Capacitors
          2. 11.2.1.2.2 4-Wire Kelvin Connections
          3. 11.2.1.2.3 VIN Slew Rate Considerations
          4. 11.2.1.2.4 Shutdown/Enable Feature
        3. 11.2.1.3 Application Curves
      2. 11.2.2 Advanced Driver Assistance Systems (ADAS) Microcontroller Connection
        1. 11.2.2.1 Basic Voltage Reference Connection
        2. 11.2.2.2 Design Requirements
        3. 11.2.2.3 Detailed Design Procedure
        4. 11.2.2.4 Enable Feature in ADAS
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Receiving Notification of Documentation Updates
    3. 14.3 Support Resources
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.