SNVSCN7C November   2023  – May 2025 REF54

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics REF54250
    6. 6.6  Electrical Characteristics REF54300
    7. 6.7  Electrical Characteristics REF54410
    8. 6.8  Electrical Characteristics REF54450
    9. 6.9  Electrical Characteristics REF54500
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Temperature Drift
    2. 7.2 Long-Term Stability
    3. 7.3 Noise Performance
      1. 7.3.1 1/f Noise
      2. 7.3.2 Broadband Noise
    4. 7.4 Thermal Hysteresis
    5. 7.5 Solder Heat Shift
    6. 7.6 Power Dissipation
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 EN Pin
      2. 8.3.2 NR Pin
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Basic Voltage Reference Connection
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Reference Attach With High Precision ADC
    3. 9.3 Power Supply Recommendation
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision B (June 2024) to Revision C (May2025)

  • Added REF54xxxCFKH information throuout the data sheetGo
  • Changed REF54500CDR device variant status from previw to production data. Added LCCC package variants in preview state.Go
  • Move REF54500CDR specifications from preview to released.Go
  • Added the 7500 hours long term stability data for SOIC package to Figure 7-3 Go
  • Added the 2000 hours long term stability data for FKH package to Figure 7-4 Go

Changes from Revision A (December 2023) to Revision B (June 2024)

  • Changed the REF54410CDR device variant status from preview to production dataGo
  • Added 2000 hours long term stability spec Go
  • Added the 2000 hours data to the long-term stability graphs Figure 6-16 and Figure 6-18 Go
  • Added the 2000 hours long term stability data to Figure 7-2 Go
  • Added variant names to the thermal hysteresis graphs Figure 7-12 and Figure 7-13 Go

Changes from Revision * (November 2023) to Revision A (December 2023)

  • Production Data ReleaseGo