SLLS994B February   2010  – July 2015 SN65HVDA1050A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Power Dissipation Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Modes
        1. 8.3.1.1 Normal Mode
        2. 8.3.1.2 Silent Mode
      2. 8.3.2 Protection Features
        1. 8.3.2.1 TXD Dominant State Timeout
        2. 8.3.2.2 Thermal Shutdown
        3. 8.3.2.3 Undervoltage Lockout and Unpowered Device
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Using the Device With 3.3-V Microcontrollers
      2. 9.1.2 Using SPLIT (VREF) With Split Termination
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Bus Loading, Length, and Number of Nodes
        2. 9.2.1.2 CAN Termination
        3. 9.2.1.3 Loop Propagation Delay
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 ESD Protection
        2. 9.2.2.2 Transient Voltage Suppresser (TVS) Diodes
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage(2) –0.3 6 V
Voltage at any bus terminal [CANH, CANL, SPLIT (VREF)] –27 40 V
IO Receiver output current 20 mA
VI Voltage input, ISO 7637 transient pulse(3) (CANH, CANL) –150 100 V
VI Voltage input (TXD, S) –0.3 6 V
TJ Junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to the network ground terminal.
(3) Tested in accordance with ISO 7637 test pulses 1, 2, 3a, 3b per IBEE system level test (Pulse 1 = –100 V, Pulse 2 = 100 V, Pulse 3a = –150 V, Pulse 3b = 100 V). If DC may be coupled with AC transients, externally protect the bus pins within the absolute maximum voltage range at any bus terminal. This device has been tested with DC bus shorts to 40 V with leading common-mode chokes. If common-mode chokes are used in the system and the bus lines may be shorted to DC, ensure that the choke type and value in combination with the node termination and shorting voltage either do not create inductive flyback outside of voltage maximum specification or use an external transient-suppression circuit to protect the transceiver from the inductive transients.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) Bus pins(2):
Pin 7 (CANH) and Pin 6 (CANL) 		±12000 V
Pin 5 [SPLIT (VREF)](3) ±10000
All pins ±4000
Charged-device model (CDM), per AEC Q100-011 ±1500
Machine model(4) ±200
IEC 61400-4-2 according to IBEE CAN EMC test specification Bus pins to GND: Pin 7 (CANH) and Pin 6 (CANL) ±7000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(2) Test method based upon JEDEC Standard 22 Test Method A114F and AEC-Q100-002, CANH and CANL bus pins stressed with respect to each other and GND.
(3) Test method based upon JEDEC Standard 22 Test Method A114F and AEC-Q100-002, SPLIT pin stressed with respect to GND.
(4) Tested in accordance JEDEC Standard 22, Test Method A115A.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage 4.75 5.25 V
VI or VIC Voltage at any bus terminal (separately or common mode) –12 12 V
VIH High-level input voltage TXD, S 2 5.25 V
VIL Low-level input voltage TXD, S 0 0.8 V
VID Differential input voltage –6 6 V
IOH High-level output current Driver –70 mA
Receiver (RXD) –2
IOL Low-level output current Driver 70 mA
Receiver (RXD) 2
TA Operating free-air temperature See Power Dissipation Characteristics –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) SN65HVDA1050A-Q1 UNIT
D (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance Low-K thermal resistance(2) 211 °C/W
High-K thermal resistance(2) 109 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 49.2 °C/W
RθJB Junction-to-board thermal resistance 50.3 °C/W
ψJT Junction-to-top characterization parameter 8 °C/W
ψJB Junction-to-board characterization parameter 49.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 49.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Tested in accordance with the low-K (EIA/JESD51-3) or high-K (EIA/JESD51-7) thermal metric definitions for leaded surface-mount packages.

6.5 Electrical Characteristics

over recommended operating conditions, TA = –40 to 125°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
SUPPLY
ICC 5-V supply current Silent mode S at VCC, VI = VCC 6 10 mA
Dominant VI = 0 V, 60-Ω load, S = 0 V 50 70
Recessive VI = VCC, No load, S = 0 V 6 10
UVCC Undervoltage reset threshold 2.8 4 V
DRIVER
VO(D) Bus output voltage (dominant) CANH VI = 0 V, S = 0 V, RL = 60 Ω (see Figure 3 and Figure 14) 2.9 3.4 4.5 V
CANL 0.8 0.85 1.2 1.5
VO(R) Bus output voltage (recessive) VI = 3 V, S = 0 V, RL = 60 Ω (see Figure 3 and Figure 14) 2 2.3 3 V
VOD(D) Differential output voltage (dominant) VI = 0 V, RL = 60 Ω, S = 0 V (see Figure 3, Figure 14, and Figure 4) 1.5 3 V
VI = 0 V, RL = 45 Ω, S = 0 V (see Figure 3, Figure 14, and Figure 4) 1.4 3 V
VOD(R) Differential output voltage (recessive) VI = 3 V, S = 0 V (see Figure 3 and Figure 14) –0.012 0.012 V
VI = 3 V, S = 0 V, No Load –0.5 0.05
VOC(ss) Steady-state common-mode output voltage S = 0 V (see Figure 9) 2 2.3 3 V
ΔVOC(ss) Change in steady-state common-mode output voltage S = 0 V (see Figure 9) 30 mV
VIH High-level input voltage, TXD input 2 V
VIL Low-level input voltage, TXD input 0.8 V
IIH High-level input current, TXD input VI at VCC –2 2 µA
IIL Low-level input current, TXD input VI at 0 V –50 –10 µA
IO(off) Power-off TXD output current VCC at 0 V, TXD at 5 V 1 µA
DRIVER (continued)
IOS(ss) Short-circuit steady-state output current, dominant VCANH = –12 V, CANL open (see Figure 12) –105 –72 mA
VCANH = 12 V, CANL open (see Figure 12) 0.36 1
VCANL = –12 V, CANH open (see Figure 12) –1 –0.5
VCANL = 12 V, CANH open (see Figure 12) 71 105
VCANH = 0 V, CANL open, TXD = low,
(see Figure 12)		 –100 –70
VCANL = 32 V, CANH open, TXD = low,
(see Figure 12		 75 140
IOS(ss) Short-circuit steady-state output current, recessive –20 V ≤ VCANH ≤ 32 V, CANL open,
TXD = high (see Figure 12)		 –15 15 mA
–20 V ≤ VCANL ≤ 32 V, CANH open,
TXD = high (see Figure 12)		 –15 15
CO Output capacitance See receiver input capacitance
RECEIVER
VIT+ Positive-going input threshold voltage S = 0 V (see Table 1) 800 900 mV
VIT– Negative-going input threshold voltage S = 0 V (see Table 1) 500 650 mV
Vhys Hysteresis voltage (VIT+ – VIT–) 100 125 mV
VOH High-level output voltage IO = –2 mA (see Figure 7) 4 4.6 V
VOL Low-level output voltage IO = 2 mA (see Figure 7) 0.2 0.4 V
II(off) Power-off bus input current (unpowered bus leakage current) CANH or CANL = 5 V,
Other pin at 0 V,
VCC at 0 V, TXD at 0 V		 165 250 µA
IO(off) Power-off RXD leakage current VCC at 0 V, RXD at 5 V 20 µA
CI Input capacitance to ground (CANH or CANL) TXD at 3 V,
VI = 0.4 sin (4E6πt) + 2.5 V		 13 pF
CID Differential input capacitance TXD at 3 V, VI = 0.4 sin (4E6πt) 6 pF
RID Differential input resistance TXD at 3 V, S = 0 V 30 80 kΩ
RIN Input resistance (CANH or CANL) TXD at 3 V, S = 0 V 15 30 40 kΩ
RI(m) Input resistance matching
[1 – RIN (CANH) / RIN (CANL))] × 100%		 V(CANH) = V(CANL) –3% 0% 3%
S PIN
VIH High-level input voltage, S input 2 V
VIL Low-level input voltage, S input 0.8 V
IIH High level input current S at 2 V 20 40 70 µA
IIL Low level input current S at 0.8 V 5 20 30 µA
SPLIT (VREF) PIN
VO Output voltage –50 µA < IO < 50 µA (VREF) 0.4 VCC 0.5 VCC 0.6 VCC V
–500 µA < IO < 500 µA (SPLIT) 0.3 VCC 0.5 VCC 0.7 VCC
ILKG Leakage current, unpowered VCC = 0 V, –12 V ≤ VSPLIT ≤ 12 V –5 5 µA
(1) All typical values are at 25°C with a 5-V supply.

6.6 Power Dissipation Characteristics

over recommended operating conditions, TA = –40 to 125°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PD Average power dissipation VCC = 5 V, TJ = 27°C, RL = 60 Ω, S = 0 V,
Input to TXD at 500 kHz, 50% duty cycle square wave,
CL at RXD = 15 pF		 112 mW
VCC = 5.5 V, TJ = 130°C, RL = 45 Ω, S = 0 V,
Input to TXD at 500 kHz, 50% duty cycle square wave,
CL at RXD = 15 pF		 170
Thermal shutdown temperature 190 °C

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY
td(LOOP2) Total loop delay, driver input to receiver output, dominant to recessive S = 0 V (see Figure 10) 90 230 ns
DEVICE SWITCHING CHARACTERISTICS
td(LOOP1) Total loop delay, driver input to receiver output, recessive to dominant S = 0 V (see Figure 10) 90 230 ns
td(LOOP2) Total loop delay, driver input to receiver output, dominant to recessive S = 0 V (see Figure 10) 90 230 ns
DRIVER SWITCHING CHARACTERISTICS
tPLH Propagation delay time, low-to-high level output S = 0 V (see Figure 5) 25 65 120 ns
tPHL Propagation delay time, high-to-low level output S = 0 V (see Figure 5) 25 45 120 ns
tr Differential output signal rise time S = 0 V (see Figure 5) 25 ns
tf Differential output signal fall time S = 0 V (see Figure 5) 50 ns
ten Enable time from silent mode to normal mode and transmission of dominant See Figure 8 1 µs
t(dom) Dominant time-out(1) ↓VI (see Figure 11) 300 450 700 µs
RECEIVER SWITCHING CHARACTERISTICS
tPLH Propagation delay time, low-to-high-level output S = 0 V or VCC (see Figure 7) 60 100 130 ns
tPHL Propagation delay time, high-to-low-level output S = 0 V or VCC (see Figure 7) 45 70 130 ns
tr Output signal rise time S = 0 V or VCC (see Figure 7) 8 ns
tf Output signal fall time S = 0 V or VCC (see Figure 7) 8 ns
(1) The TXD dominant time out, t(dom), disables the driver of the transceiver once the TXD has been dominant longer than t(dom), which releases the bus lines to recessive, preventing a local failure from locking the bus dominant. The driver may only transmit dominant again after TXD has been returned HIGH (recessive). Although this protects the bus from local faults, locking the bus dominant, it limits the minimum data rate possible. The CAN protocol allows a maximum of eleven successive dominant bits (on TXD) for the worst case, where five successive dominant bits are followed immediately by an error frame. This, along with the t(dom) minimum, limits the minimum bit rate. The minimum bit rate may be calculated by: Minimum Bit Rate = 11 / t(dom) = 11 bits / 300 µs = 37 kbps.

6.8 Typical Characteristics

SN65HVDA1050A-Q1 D001_SLLS994.gif
S = 0 V RL = 60 Ω TXD Input 125 kHz
Figure 1. Driver Differential Voltage vs Supply Voltage
SN65HVDA1050A-Q1 D002_SLLS994.gif
Figure 2. Dominant Driver Differential Voltage
vs Free-Air Temperature