SLLS530C April   2002  – February 2019 SN65LVDT14 , SN65LVDT41

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      SN65LVDT41 Functional Diagram
      2.      SN65LVDT14 Functional Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     SN65LVDT41 Pin Functions
    2.     SN65LVDT14 Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Receiver Electrical Characteristics
    6. 6.6  Driver Electrical Characteristics
    7. 6.7  Device Electrical Characteristics
    8. 6.8  Receiver Switching Characteristics
    9. 6.9  Driver Switching Characteristics
    10. 6.10 Typical Characteristics
      1. 6.10.1 Receiver
      2. 6.10.2 Driver
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 SN65LVDTxx Driver and Receiver Functionality
      2. 8.3.2 Integrated Termination
      3. 8.3.3 SN65LVDTxx Equivalent Circuits
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Extending a Serial Peripheral Interface Using LVDS Signaling Over Differential Transmission Cables
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 SPI Propagation Delay Limitations
        2. 9.2.2.2 Interconnecting Media
        3. 9.2.2.3 Input Fail-Safe Biasing
        4. 9.2.2.4 Power Decoupling Recommendations
        5. 9.2.2.5 PCB Transmission Lines
        6. 9.2.2.6 Probing LVDS Transmission Lines on PCB
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Microstrip vs. Stripline Topologies
      2. 11.1.2 Dielectric Type and Board Construction
      3. 11.1.3 Recommended Stack Layout
      4. 11.1.4 Separation Between Traces
      5. 11.1.5 Crosstalk and Ground Bounce Minimization
      6. 11.1.6 Decoupling
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

SPI Propagation Delay Limitations

In typical SPI communication, the SPI master decides the sampling rate and data transfer rate, sends data at the rising edge of one clock cycle, and receives data on the falling edge within the same clock cycle. In a low latency system, the data in peripheral device should be made available to the host system with minimum delay. However in systems with high latency, the total round trip propagation delay of the SPI system must be less than half the SCLK period to avoid missing bits. There are three major delay contributors in a typical system—the SPI peripheral, data link device, and transmission media. Both the SPI peripheral and the data link device have fixed delay. The delay in transmission media, however, increases as communication distance increases. The relationship between cable length and SPI clock frequency can be seen in Figure 22. Figure 22 refers to a system where both MISO and MOSI are used, accounting for the case of slave-to-mater data transmission, including roundtrip delay. The specific setup is described in Extending SPI and McBSP with differential interface products (SLLA142)