SCLS226N October   1995  – June 2025 SN54AHC244 , SN74AHC244

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCC = 3.3V ± 0.3V
    7. 5.7  Switching Characteristics, VCC = 5V ± 0.5V
    8. 5.8  Noise Characteristics
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Balanced CMOS 3-State Outputs
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DB|20
  • RKS|20
  • NS|20
  • N|20
  • DGS|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

These octal buffers and drivers are designed specifically to improve the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

Device Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE(3)
SN54AHC244 J (CDIP, 20) 24.2mm x 7.62mm 24.2mm x 6.92mm
W (CFP, 20) 13.09mm x 8.13mm 13.09mm x 6.92mm
FK (LCCC, 20) 8.89 mm x 8.89 mm 8.89 mm x 8.89 mm
SN74AHC244 DB (SSOP, 20) 7.2mm × 7.8mm 7.50mm x 5.30mm
DW (SOIC, 20) 12.80mm × 10.3mm 12.8mm x 7.5mm
N (PDIP, 20) 24.33mm x 9.4mm 25.40mm x 6.35mm
NS (SOP, 20) 12.60mm x 7.8mm 12.6mm x 5.30mm
DGV (TVSOP, 20) 5.00mm x 6.4mm 5.00mm x 4.40mm
PW (TSSOP, 20) 6.50mm × 6.4mm 6.50mm x 4.40mm
DGS (VSSOP, 20) 5.10mm × 4.90mm 5.10mm × 3.00mm
RKS (VQFN, 20) 4.50mm × 2.50mm 4.50mm × 2.50mm
(1) For more information, see Section 11.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
(3) The body size (length × width) is a nominal value and does not include pins.
SN54AHC244 SN74AHC244