SCES296AG February   2000  – October 2025 SN74LVC1G07

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, –40°C to 85°C
    7. 5.7 Switching Characteristics, –40°C to 125°C
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 (Open Drain)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74LVC1G07UNIT
DBVDCKDRLDRYYZPDPW
5 PINS5 PINS5 PINS6 PINS5 PINS4 PINS
RθJAJunction-to-ambient thermal resistance357.1371.0243439130340°C/W
RθJC(top)Junction-to-case (top) thermal resistance263.7297.57827754215
RθJBJunction-to-board thermal resistance264.4258.67827151294
ψJTJunction-to-top characterization parameter195.6195.61084141
ψJBJunction-to-board characterization parameter262.2256.27727150294
RθJC(bot)Junction-to-case (bottom) thermal resistance–––––250
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.