SCES296AE February 2000 – September 2020 SN74LVC1G07
The SN74LVC1G07 device contains one open-drain buffer with a maximum sink current of 32 mA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The DPW package technology is a major breakthrough in IC packaging. The DPW 0.64 mm square footprint saves significant board space over other package options while still retaining the traditional manufacturing friendly lead pitch of 0.5 mm.