SCES406L July   2002  – August 2019 SN74LVC1G18

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2. 5.1 Logic Diagram (Positive Logic)
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics, –40 to 85°C
    7. 6.7 Switching Characteristics, –40 to 125°C
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Partial Power Down (Ioff)
      3. 8.3.3 Standard CMOS Inputs
      4. 8.3.4 Over-voltage Tolerant Inputs
      5. 8.3.5 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • DSF|6
  • YZP|6
  • DCK|6
  • DRY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

This non-inverting demultiplexer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G18 device is a 1-of-2 non-inverting demultiplexer with a 3-state output. This device buffers the data on input A and passes it to either output Y0 or Y1, depending on whether the state of the select (S) input is low or high, respectively.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SN74LVC1G18DBVR SOT-23 (6) 2.90 mm × 2.80 mm
SN74LVC1G18DCKR SC70 (6) 2.00 mm × 1.10 mm
SN74LVC1G18DRYR SON (6) 1.45 mm × 1.00 mm
SN74LVC1G18DSFR SON (6) 1.00 mm × 1.00 mm
SN74LVC1G18YZPR DSBGA (6) 1.39 mm × 0.89 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.