SCES929A January   2022  – May 2022 SN74LXC2T45-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: Tsk, TMAX
    7. 6.7  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    8. 6.8  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    9. 6.9  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    10. 6.10 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    11. 6.11 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    12. 6.12 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 8.3.1.1 I/O's with Integrated Dynamic Pull-Down Resistors
        2. 8.3.1.2 Control Inputs with Integrated Static Pull-Down Resistors
      2. 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 VCC Isolation and VCC Disconnect (Ioff-float)
      5. 8.3.5 Over-Voltage Tolerant Inputs
      6. 8.3.6 Glitch-Free Power Supply Sequencing
      7. 8.3.7 Negative Clamping Diodes
      8. 8.3.8 Fully Configurable Dual-Rail Design
      9. 8.3.9 Supports High-Speed Translation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Enable Times
    3. 9.3 Typical Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • DTT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Switching Characteristics: Tsk, TMAX

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCCI VCCO Operating free-air temperature (TA) UNIT
-40°C to 125°C
MIN TYP MAX
TMAX - Maximum Data Rate 50% Duty Cycle Input
One channel switching

20% of pulse > 0.7*VCCO
20% of pulse < 0.3*VCCO		 Up Translation 3.0 V – 3.6 V 4.5 V – 5.5 V 200 420 Mbps
2.25 V – 2.75 V 4.5 V – 5.5 V 150 300
1.65 V – 1.95 V 4.5 V – 5.5 V 100 200
1.1 V – 1.3 V 4.5 V – 5.5 V 20 40
1.65 V – 1.95 V 3.0 V – 3.6 V 100 210
1.1 V – 1.3 V 3.0 V – 3.6 V 10 20
1.1 V – 1.3 V 1.65 V – 1.95 V 5 10
Down Translation 4.5 V – 5.5 V 3.0 V – 3.6 V 100 210
4.5 V – 5.5 V 2.25 V – 2.75 V 75 140
4.5 V – 5.5 V 1.65 V – 1.95 V 50 75
4.5 V – 5.5 V 1.1 V – 1.3 V 15 30
3.0 V – 3.6 V 1.65 V – 1.95 V 40 75
3.0 V – 3.6 V 1.1 V – 1.3 V 10 20
1.65 V – 1.95 V 1.1 V – 1.3 V 5 10
tsk - Output skew Timing skew between any two switching outputs within the same device Up Translation 3.0 V – 3.6 V 4.5 V – 5.5 V 0.2 ns
1.65 V – 1.95 V 4.5 V – 5.5 V 0.5
1.1 V – 1.3 V 4.5 V – 5.5 V 3.5
1.65 V – 1.95 V 3.0 V – 3.6 V 0.5
1.1 V – 1.3 V 3.0 V – 3.6 V 3.5
1.1 V – 1.3 V 1.65 V – 1.95 V 2.5
Down Translation 4.5 V – 5.5 V 3.0 V – 3.6 V 0.2
4.5 V – 5.5 V 1.65 V – 1.95 V 0.5
4.5 V – 5.5 V 1.1 V – 1.3 V 2
3.0 V – 3.6 V 1.65 V – 1.95 V 0.5
3.0 V – 3.6 V 1.1 V – 1.3 V 2
1.65 V – 1.95 V 1.1 V – 1.3 V 2