SLLS008E June 1986 – October 2023 SN75ALS193
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | SN75ALS193 | UNIT | ||
---|---|---|---|---|
N (PDIP) | D (SOIC) | |||
16 Pins | 16 Pins | |||
R θJA | Junction-to-ambient thermal resistance | 60.6 | 84.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 48.1 | 43.5 | °C/W |
R θJB | Junction-to-board thermal resistance | 40.6 | 43.2 | °C/W |
ψ JT | Junction-to-top characterization parameter | 27.5 | 10.4 | °C/W |
ψ JB | Junction-to-board characterization parameter | 40.3 | 42.8 | °C/W |