SBFS022C June   2003  – October 2015 SRC4192 , SRC4193

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Port Operation
      2. 7.3.2 Output Port Operation
      3. 7.3.3 Soft Mute Function
      4. 7.3.4 Digital Attenuation (SRC4193 Only)
      5. 7.3.5 Ready Output
      6. 7.3.6 Ratio Output (SRC4193 Only)
      7. 7.3.7 Serial Peripheral Interface (SPI) Port: SRC4193 Only
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset and Power Down Operation
      2. 7.4.2 Audio Port Modes
      3. 7.4.3 Bypass Mode
    5. 7.5 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Interfacing to Digital Audio Receivers and Transmitters
      2. 8.1.2 TDM Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Control Method
        2. 8.2.2.2 Audio Input and Output
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Reference Clock
      2. 10.1.2 Pin Compatibility With the Analog Devices AD1896 (SRC4192 Only)
        1. 10.1.2.1 Crystal Oscillator
        2. 10.1.2.2 Reference Clock Frequency
        3. 10.1.2.3 Master Mode Maximum Sampling Frequency
        4. 10.1.2.4 Matched Phase Mode
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following: SRC4192EVM Evaluation Module, SBAU088

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 10. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
SRC4192 Click here Click here Click here Click here Click here
SRC4193 Click here Click here Click here Click here Click here

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.