SCPS200E July   2009  – April 2019 TCA9555

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 5-V Tolerant I/O Ports
      2. 9.3.2 Hardware Address Pins
      3. 9.3.3 Interrupt (INT) Output
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-On Reset (POR)
      2. 9.4.2 Powered-Up
    5. 9.5 Programming
      1. 9.5.1 I/O Port
      2. 9.5.2 I2C Interface
        1. 9.5.2.1 Bus Transactions
          1. 9.5.2.1.1 Writes
          2. 9.5.2.1.2 Reads
      3. 9.5.3 Device Address
      4. 9.5.4 Control Register and Command Byte
    6. 9.6 Register Maps
      1. 9.6.1 Register Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Calculating Junction Temperature and Power Dissipation
        2. 10.2.2.2 Minimizing ICC When I/O Is Used to Control LED
        3. 10.2.2.3 Pull-Up Resistor Calculation
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TCA9555 UNIT
PW (TSSOP) DB (SSOP) RTW (WQFN) RGE (VQFN)
24 PINS 24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 108.8 92.9 43.6 48.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54 53.5 46.2 58.1 °C/W
RθJB Junction-to-board thermal resistance 62.8 50.4 22.1 27.1 °C/W
ψJT Junction-to-top characterization parameter 11.1 21.9 1.5 3.3 °C/W
ψJB Junction-to-board characterization parameter 62.3 50.1 22.2 27.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 10.7 15.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.