SLLSES9C February   2016  – March 2019 TCAN1042-Q1 , TCAN1042G-Q1 , TCAN1042GV-Q1 , TCAN1042H-Q1 , TCAN1042HG-Q1 , TCAN1042HGV-Q1 , TCAN1042HV-Q1 , TCAN1042V-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, Specifications
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Rating
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 Thermal Shutdown (TSD)
      3. 9.3.3 Undervoltage Lockout
      4. 9.3.4 Unpowered Device
      5. 9.3.5 Floating Terminals
      6. 9.3.6 CAN Bus Short Circuit Current Limiting
      7. 9.3.7 Digital Inputs and Outputs
        1. 9.3.7.1 5-V VCC Only Devices (Devices without the "V" Suffix):
        2. 9.3.7.2 5 V VCC with VIO I/O Level Shifting (Devices with the "V" Suffix):
    4. 9.4 Device Functional Modes
      1. 9.4.1 CAN Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (May 2017) to C Revision

  • Changed the ICC MAX value From: 180 mA To: 110 mA in the Electrical CharacteristicsGo
  • Changed the tWK_FILTER MAX value From: 1.85 µs To: 1.8 µs in the DEVICE SWITCHING CHARACTERISTICSGo

Changes from A Revision (May 2016) to B Revision

  • Added items to the Automotive Applications FeaureGo
  • Changed Feature "Meets the Released ISO 11898-2:2007 and ISO 11898-2:2003 Physical Layer Standards" To: Meets the ISO 11898-2:2016 and ISO 11898-5:2007 Physical Layer StandardsGo
  • Deleted Feature From: Meets the December 17th, 2015 Draft of ISO 11898-2 Physical Layer UpdateGo
  • Changed Feature From: "All devices support 2 Mbps CAN FD.." To: "All Devices Support Classic CAN and 2 Mbps CAN FD.."Go
  • Added Feature "Available in SOIC(8) package and leadless VSON(8) package..."Go
  • Changed the Applications listGo
  • Changed Feature From: "EMC: SAE J2962, GIFT/ICT, ISO 16845" To: "Meets requirements of SAE J2962, GIFT/ICT, ISO16845" Go
  • Added new devices to the Device Comparison TableGo
  • Added Storage temperature range to the Absolute Maximum Ratings tableGo
  • Changed the ESD Ratings table to show the D(SOIC) and DRB (VSON) valuesGo
  • Changed Charged Device Model (CDM) From: ±750 To: ±1500 in the ESD tableGo
  • Changed TBD to values for the DRB (VSON) Package in the ESD tableGo
  • Added the DRB package to the Thermal Information table Go
  • Added the Power Rating table Go
  • Changed VSYM in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Changed VSYM_DC in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t) + 2.5 V" from the Test Condition of CI in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t)" from the Test Condition of CID in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Added "-30 V ≤ VCM ≤ +30" to the Test Condition of RID and RIN in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Changed the tMODE TYP value From: 1 µs To: 9 µS in the DEVICE SWITCHING CHARACTERISTICS tableGo
  • Added Note 2 and Changed Table 3, BUS OUTPUT columGo
  • Changed Standby Mode sectionGo

Changes from * Revision (March 2016) to A Revision