SLLSFJ3C February   2021  – December 2021 TCAN1044A-Q1 , TCAN1044AV-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings - IEC Specifications
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Characteristics
    6. 7.6  Supply Characteristics
    7. 7.7  Dissipation Ratings
    8. 7.8  Electrical Characteristics
    9. 7.9  Switching Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Pin Description
        1. 9.3.1.1 TXD
        2. 9.3.1.2 GND
        3. 9.3.1.3 VCC
        4. 9.3.1.4 RXD
        5. 9.3.1.5 VIO
        6. 9.3.1.6 CANH and CANL
        7. 9.3.1.7 STB (Standby)
      2. 9.3.2 CAN Bus States
      3. 9.3.3 TXD Dominant Timeout (DTO)
      4. 9.3.4 CAN Bus short-circuit current limiting
      5. 9.3.5 Thermal Shutdown (TSD)
      6. 9.3.6 Undervoltage Lockout
      7. 9.3.7 Unpowered Device
      8. 9.3.8 Floating pins
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 CAN Termination
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Bus Loading, Length and Number of Nodes
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

Figure 6-1 DDF Package, 8-Pin SOT, Top View
Figure 6-2 D Package, 8-Pin SOIC, Top VIew
Figure 6-3 DRB Package, 8-Pin VSON, Top View
Table 6-1 Pin Functions
Pins Type Description
Name No.
TXD 1 Digital Input CAN transmit data input; integrated pull-up
GND 2 GND Ground connection
VCC 3 Supply 5-V supply voltage
RXD 4 Digital Output CAN receive data output, tri-stated when device powered off
NC 5 — Not internally connected; Devices without VIO
VIO Supply I/O supply voltage for devices with suffix 'V'
CANL 6 Bus IO Low-level CAN bus input/output line
CANH 7 Bus IO High-level CAN bus input/output line
STB 8 Digital Input Standby input for mode control; integrated pull-up
Thermal Pad (VSON only) — Connect the thermal pad to any internal PCB ground plane using multiple vias for optimal thermal performance.