SLLSFJ3C February   2021  – December 2021 TCAN1044A-Q1 , TCAN1044AV-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings - IEC Specifications
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Characteristics
    6. 7.6  Supply Characteristics
    7. 7.7  Dissipation Ratings
    8. 7.8  Electrical Characteristics
    9. 7.9  Switching Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Pin Description
        1. 9.3.1.1 TXD
        2. 9.3.1.2 GND
        3. 9.3.1.3 VCC
        4. 9.3.1.4 RXD
        5. 9.3.1.5 VIO
        6. 9.3.1.6 CANH and CANL
        7. 9.3.1.7 STB (Standby)
      2. 9.3.2 CAN Bus States
      3. 9.3.3 TXD Dominant Timeout (DTO)
      4. 9.3.4 CAN Bus short-circuit current limiting
      5. 9.3.5 Thermal Shutdown (TSD)
      6. 9.3.6 Undervoltage Lockout
      7. 9.3.7 Unpowered Device
      8. 9.3.8 Floating pins
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 CAN Termination
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Bus Loading, Length and Number of Nodes
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.