SLOS382E September   2001  – May 2015 THS3122 , THS3125

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Dissipation Ratings Table
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Electrical Characteristics: Dynamic Performance
    5. 7.5  Electrical Characteristics: Noise and Distortion Performance
    6. 7.6  Electrical Characteristics: DC Performance
    7. 7.7  Electrical Characteristics: Input Characteristics
    8. 7.8  Electrical Characteristics: Output Characteristics
    9. 7.9  Electrical Characteristics: Power Supply
    10. 7.10 Electrical Characteristics: Shutdown Characteristics (THS3125 Only)
    11. 7.11 Typical Characteristics: Table Of Graphs
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Feature Description
      1. 8.2.1 Maximum Slew Rate For Repetitive Signals
      2. 8.2.2 Saving Power with Shutdown Functionality and Setting Threshold Levels with the Reference Pin
      3. 8.2.3 Power-Down Reference Pin Operation
    3. 8.3 Device Functional Modes
      1. 8.3.1 Wideband, Noninverting Operation
      2. 8.3.2 Wideband, Inverting Operation
      3. 8.3.3 Single-Supply Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Video Distribution
      2. 9.1.2 Driving Capacitive Loads
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Printed-Circuit Board Layout Techniques For Optimal Performance
      2. 10.1.2 PowerPAD Design Considerations
      3. 10.1.3 PowerPAD Layout Considerations
      4. 10.1.4 Power Dissipation And Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Related Links

Table 3 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 3. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
THS3122 Click here Click here Click here Click here Click here
THS3125 Click here Click here Click here Click here Click here

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.