SLOS382E September   2001  – May 2015 THS3122 , THS3125

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Dissipation Ratings Table
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Electrical Characteristics: Dynamic Performance
    5. 7.5  Electrical Characteristics: Noise and Distortion Performance
    6. 7.6  Electrical Characteristics: DC Performance
    7. 7.7  Electrical Characteristics: Input Characteristics
    8. 7.8  Electrical Characteristics: Output Characteristics
    9. 7.9  Electrical Characteristics: Power Supply
    10. 7.10 Electrical Characteristics: Shutdown Characteristics (THS3125 Only)
    11. 7.11 Typical Characteristics: Table Of Graphs
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Feature Description
      1. 8.2.1 Maximum Slew Rate For Repetitive Signals
      2. 8.2.2 Saving Power with Shutdown Functionality and Setting Threshold Levels with the Reference Pin
      3. 8.2.3 Power-Down Reference Pin Operation
    3. 8.3 Device Functional Modes
      1. 8.3.1 Wideband, Noninverting Operation
      2. 8.3.2 Wideband, Inverting Operation
      3. 8.3.3 Single-Supply Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Video Distribution
      2. 9.1.2 Driving Capacitive Loads
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Printed-Circuit Board Layout Techniques For Optimal Performance
      2. 10.1.2 PowerPAD Design Considerations
      3. 10.1.3 PowerPAD Layout Considerations
      4. 10.1.4 Power Dissipation And Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Options(1)

TA PACKAGED DEVICE EVALUATION
MODULES
SOIC-8
(D)		 HSOP-8 PowerPAD
(DDA)		 SOIC-14
(D)		 HTSSOP-14
(PWP)
0°C to +70°C THS3122CD THS3122CDDA THS3125CD THS3125CPWP THS3122EVM,
THS3125EVM
–40°C to +85°C THS3122ID THS3122IDDA THS3125ID THS3125IPWP
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.