SLOS616D March   2010  – March 2015 THS788

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Host Serial Interface DC Characteristics
    7. 7.7 Host Serial Interface AC Characteristics
    8. 7.8 Power Consumption
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Counter, Latches, Clock Multiplier
      2. 8.3.2 Channels, Interpolator
      3. 8.3.3 FIFO
      4. 8.3.4 Calibration, ALU, Tag, Shifter
      5. 8.3.5 Serial Interface, Temperature, Overhead
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial-Results Interface
      2. 8.4.2 Result-Interface Clock
      3. 8.4.3 DDR Mode
      4. 8.4.4 Output Interface Throughput
      5. 8.4.5 Counter Range
        1. 8.4.5.1 Preconditioning Holdoff Delay Time
        2. 8.4.5.2 Arming Conditions
      6. 8.4.6 Resister Map Descriptions for All Channels and Central Register
    5. 8.5 Programming
      1. 8.5.1 Host Processor Bus Interface
        1. 8.5.1.1  Serial Interface
        2. 8.5.1.2  Read vs Write Cycle
        3. 8.5.1.3  Parallel (Broadcast) Write
        4. 8.5.1.4  Address
        5. 8.5.1.5  Data
        6. 8.5.1.6  Reset
        7. 8.5.1.7  Chip ID
        8. 8.5.1.8  Read Operations
        9. 8.5.1.9  Write Operations
        10. 8.5.1.10 Write Operations to Multiple Destinations
      2. 8.5.2 Serial-Results Interface and ALU
        1. 8.5.2.1 Event Latches
        2. 8.5.2.2 FIFO
        3. 8.5.2.3 Result-Interface Operation
        4. 8.5.2.4 Serial Results Latency
        5. 8.5.2.5 TMU Calibration
        6. 8.5.2.6 Temperature Sensor
    6. 8.6 Register Maps
      1. 8.6.1 Register Address Space
      2. 8.6.2 Register Map Detail
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Time Measurement
        2. 9.2.2.2 Output Clock to Data/Strobe Phasing
        3. 9.2.2.3 Master Clock Input and Clock Multiplier
        4. 9.2.2.4 Temperature Measurement and Alarm Circuit
        5. 9.2.2.5 LVDS-Compatible I/Os
        6. 9.2.2.6 LVDS-Compatible Inputs
        7. 9.2.2.7 LVDS-Compatible Outputs
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Four Event Channels + Sync Channel
  • Single-Shot Accuracy: 8 ps, One Sigma
  • Precision: 13 ps
  • Result Interface Range: 0 s to 7 s
  • Event Input Rate: 200 MHz
  • Programmable Serial-Result Interface Speed:
    75 MHz to 300 MHz
  • High-Speed Serial Host-Processor Bus Interface: 50 MHz
  • High-Speed LVDS-Compatible Serial-Result Bus per Channel
  • Programmable Serial-Result Bus Length
  • Temperature Sensor
  • Single 3.3-V Supply
  • Power: 675 mW per Channel, 18 Bits, 300 MHz,
    Four Channels

2 Applications

  • Automatic Test Equipment
  • Benchtop Time-Measurement Equipment
  • Radar and Sonar
  • Medical Imaging
  • Mass Spectroscopy
  • Nuclear and Particle Physics
  • Laser Distance Measurement
  • Ultrasonic Flow Measurement

3 Description

The THS788 device is a four-channel timing measurement unit (TMU) that incorporates a time-to-digital converter (TDC) architecture for fast and accurate measurements. The TMU can provide 8 ps of single-shot accuracy. The TDC has a 13-ps resolution (LSB), which is derived from an external master clock of 200 MHz. The TDC uses fast LVDS-compatible interfaces for all of its event inputs and serial result outputs, which allows for fast and reliable data transfer. Each channel can process timestamps at a maximum speed of 200 MSPS.

The THS788 device has a wide range of programmability that makes it flexible in different applications. The serial-result interface has programmable data length, frequency, and data-rate mode (DDR and normal). The event channels can be programmed to take timestamps on rising edges or falling edges. The TMU has a mode for event management, in which the user can program wait times before measurements. This programming is achieved through a 50-MHz LVCMOS interface.

The THS788 device is available in an HTQFP-100 package with a heat slug on top for easy heat-sink access. The device is built using TI's RF SiGe process technology, which allows for maximum timing accuracy with low power.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
THS788 HTQFP (100) 14.00 mm × 14.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

4 Simplified Schematic

THS788 T0429-01_LOS616.gif