SLOS616D March   2010  – March 2015 THS788

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Host Serial Interface DC Characteristics
    7. 7.7 Host Serial Interface AC Characteristics
    8. 7.8 Power Consumption
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Counter, Latches, Clock Multiplier
      2. 8.3.2 Channels, Interpolator
      3. 8.3.3 FIFO
      4. 8.3.4 Calibration, ALU, Tag, Shifter
      5. 8.3.5 Serial Interface, Temperature, Overhead
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial-Results Interface
      2. 8.4.2 Result-Interface Clock
      3. 8.4.3 DDR Mode
      4. 8.4.4 Output Interface Throughput
      5. 8.4.5 Counter Range
        1. 8.4.5.1 Preconditioning Holdoff Delay Time
        2. 8.4.5.2 Arming Conditions
      6. 8.4.6 Resister Map Descriptions for All Channels and Central Register
    5. 8.5 Programming
      1. 8.5.1 Host Processor Bus Interface
        1. 8.5.1.1  Serial Interface
        2. 8.5.1.2  Read vs Write Cycle
        3. 8.5.1.3  Parallel (Broadcast) Write
        4. 8.5.1.4  Address
        5. 8.5.1.5  Data
        6. 8.5.1.6  Reset
        7. 8.5.1.7  Chip ID
        8. 8.5.1.8  Read Operations
        9. 8.5.1.9  Write Operations
        10. 8.5.1.10 Write Operations to Multiple Destinations
      2. 8.5.2 Serial-Results Interface and ALU
        1. 8.5.2.1 Event Latches
        2. 8.5.2.2 FIFO
        3. 8.5.2.3 Result-Interface Operation
        4. 8.5.2.4 Serial Results Latency
        5. 8.5.2.5 TMU Calibration
        6. 8.5.2.6 Temperature Sensor
    6. 8.6 Register Maps
      1. 8.6.1 Register Address Space
      2. 8.6.2 Register Map Detail
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Time Measurement
        2. 9.2.2.2 Output Clock to Data/Strobe Phasing
        3. 9.2.2.3 Master Clock Input and Clock Multiplier
        4. 9.2.2.4 Temperature Measurement and Alarm Circuit
        5. 9.2.2.5 LVDS-Compatible I/Os
        6. 9.2.2.6 LVDS-Compatible Inputs
        7. 9.2.2.7 LVDS-Compatible Outputs
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from C Revision (January 2015) to D Revision

  • Updated Features to remove "800 ps" from single-shot accuracyGo
  • Updated measurement accuracy after calibration, mean values to –8 and 8 ps and updated single-event accuracy, one sigma parameter to 8 ps in Electrical CharacteristicsGo

Changes from B Revision (June 2011) to C Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go