SLOS588G June   2008  – May 2025

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings #GUID-CD5A394D-84DA-49EE-9F1D-C347D3339D1D/SLOS4567624
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 TL4050x20-Q1 Electrical Characteristics
    6. 5.6 TL4050x25-Q1 Electrical Characteristics
    7. 5.7 TL4050x41-Q1 Electrical Characteristics
    8. 5.8 TL4050x50-Q1 Electrical Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
  8. 7 Application Information
    1. 7.1 Output Capacitor
    2. 7.2 SOT-23-3 Pin Connections
    3. 7.3 Use With ADCs or DACs
    4. 7.4 Cathode and Load Currents
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 SOT-23-3 Pin Connections

There is a parasitic Schottky diode connected between pins 2 and 3 of the SOT-23-3 packaged device. Thus, pin 3 of the SOT-23-3 package must be left floating or connected to pin 2. In applications with high electromagnetic interference (for example, when placed near transformers or other electromagnetic sources) or significant high-frequency switching noise, TI recommends connecting this pin to the anode.