SLCS114F November   1983  – June 2025 TLC372

PRODUCTION DATA  

  1.   1
  2. Features
  3. Description
  4. Device Comparison Table
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Electrical Characteristics
    4. 5.4 Switching Characteristics
    5. 5.5 Electrical Characteristics
  7. Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input
      2. 7.4.2 ESD Protection
      3. 7.4.3 Unused Inputs
      4. 7.4.4 Open-Drain Output
      5. 7.4.5 Hysteresis
        1. 7.4.5.1 Inverting Comparator With Hysteresis
        2. 7.4.5.2 Non-Inverting Comparator With Hysteresis
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Comparator Definitions
        1. 8.1.1.1 Operation
        2. 8.1.1.2 Propagation Delay
        3. 8.1.1.3 Overdrive and Underdrive Voltage
    2. 8.2 Typical Applications
      1. 8.2.1 Window Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

For accurate comparator applications, a clean, stable power supply is important to minimize output glitches. Output rise and fall times are in the tens of nanoseconds, and must be treated as high speed logic devices. The bypass capacitor must be as close to the supply pin as possible and connected to a solid ground plane, and preferably directly between the V+ and GND pins.

Minimize coupling between outputs and inputs to prevent output oscillations. Do not run output and input traces in parallel unless there is a V+ or GND trace between output to reduce coupling. When series resistance is added to inputs, place resistor close to the device. A low value (≤100 ohms) resistor can also be added in series with the output to dampen any ringing or reflections on long, non-impedance controlled traces. For best edge shapes, controlled impedance traces with back-terminations must be used when routing long distances.