SBOS837A November   2016  – January 2019 TLV2314-Q1 , TLV314-Q1 , TLV4314-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      EMIRR vs Frequency
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: TLV314-Q1
    2.     Pin Functions: TLV2314-Q1
    3.     Pin Functions: TLV4314-Q1
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: TLV314-Q1
    5. 6.5 Thermal Information: TLV2314-Q1
    6. 6.6 Thermal Information: TLV4314-Q1
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 7.3.5 Capacitive Load and Stability
      6. 7.3.6 EMI Susceptibility and Input Filtering
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
    1. 9.1 Input and ESD Protection
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TLVx314-Q1 family of single-, dual-, and quad-channel operational amplifiers represents a new generation of low-power, general-purpose operational amplifiers. Rail-to-rail input and output swings (RRIO), low quiescent current (150 μA typically at 5 V) combine with a wide bandwidth of 3 MHz to make this family very attractive for a variety of battery-powered applications that require a good balance between cost and performance. The TLVx314-Q1 family achieves a low-input bias current of 1 pA, making it an excellent choice for high impedance sensors.

The robust design of the TLVx314-Q1 devices provides ease-of-use to the circuit designer: unity-gain stability, RRIO, capacitive loads of up to 300-pF, an integrated RF and EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).

These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V), and are specified over the extended industrial temperature range of –40°C to +125°C.

The TLV314-Q1 (single) is available in both 5-pin SC70 and SOT-23 packages. The TLV2314-Q1 (dual) is offered in 8-pin SOIC and VSSOP packages. The quad-channel TLV4314-Q1 is offered in a 14-pin TSSOP package.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TLV314-Q1 SOT-23 (5) 2.90 mm × 1.60 mm
SC70 (5) 2.00 mm × 1.25 mm
TLV2314-Q1 SOIC (8) 4.90 mm × 3.91 mm
TLV4314-Q1 TSSOP (14) 5.00 mm × 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.