SLOS351E February   2004  – November 2016 TLV271 , TLV272 , TLV274


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Recommended Operating Conditions
    3. 7.3  Thermal Information: TLV271
    4. 7.4  Thermal Information: TLV272
    5. 7.5  Thermal Information: TLV274
    6. 7.6  Electrical Characteristics: DC Characteristics
    7. 7.7  Electrical Characteristics: Input Characteristics
    8. 7.8  Electrical Characteristics: Output Characteristics
    9. 7.9  Electrical Characteristics: Power Supply
    10. 7.10 Electrical Characteristics: Dynamic Performance
    11. 7.11 Electrical Characteristics: Noise/Distortion Performance
    12. 7.12 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail to Rail Output
      2. 8.3.2 Offset Voltage
      3. 8.3.3 Driving a Capacitive Load
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 General Configurations
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resource
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Description


The TLV27x operates from a single power supply and consumes only 550 µA of quiescent current. With rail-to-rail output swing capability and 3-MHz bandwidth, the TLV27x is ideal for battery-powered and industrial applications.

Functional Block Diagram

TLV271 TLV272 TLV274 FBD_SLOS351.gif

Feature Description

Rail to Rail Output

The TLV27x family of opamps features a rail to trail output stage. Rail to rail outputs allow for a wide dynamic range in low voltage systems. This feature along with low power and wide bandwidth make the TLV27x family suitable for portable and battery powered systems.

Offset Voltage

The output offset voltage (VOO) is the sum of the input offset voltage (VIO) and both input bias currents (IIB) times the corresponding gains. Use the schematic in Figure 25 and Equation 1 to calculate the output offset voltage:

TLV271 TLV272 TLV274 ai_output_offset_voltage_model_los351.gif Figure 25. Output Offset Voltage Model
Equation 1. TLV271 TLV272 TLV274 q_voo_vio_los351.gif

Driving a Capacitive Load

When the amplifier is configured in this manner, capacitive loading directly on the output decreases the device phase margin, leading to high frequency ringing or oscillations. Therefore, for capacitive loads of greater than 10 pF, TI recommends placing a resistor in series (RNULL) with the output of the amplifier, as shown in Figure 26. A minimum value of 20 Ω should work well for most applications.

TLV271 TLV272 TLV274 ai_drv_cap_load_los351.gif Figure 26. Driving a Capacitive Load

Device Functional Modes

The TLV27x has a single functional mode. It is operational when the power supply applied to the device is between 2.7 V (±1.35 V) and 16 V (±8 V). Electrical parameters that can vary with operating conditions are shown in Typical Characteristics.