SLOS351E February   2004  – November 2016 TLV271 , TLV272 , TLV274

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Recommended Operating Conditions
    3. 7.3  Thermal Information: TLV271
    4. 7.4  Thermal Information: TLV272
    5. 7.5  Thermal Information: TLV274
    6. 7.6  Electrical Characteristics: DC Characteristics
    7. 7.7  Electrical Characteristics: Input Characteristics
    8. 7.8  Electrical Characteristics: Output Characteristics
    9. 7.9  Electrical Characteristics: Power Supply
    10. 7.10 Electrical Characteristics: Dynamic Performance
    11. 7.11 Electrical Characteristics: Noise/Distortion Performance
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail to Rail Output
      2. 8.3.2 Offset Voltage
      3. 8.3.3 Driving a Capacitive Load
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 General Configurations
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resource
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison Table

DEVICE (1) VDD (V) VIO (μV) IQ/Ch (μA) IIB (pA) GBW (MHz) SR (V/μs) SHUTDOWN RAIL-TO-RAIL SINGLES/
DUALS/
QUADS
TLV27x 2.7 to 16 500 550 1 3 2.4 — O S/D/Q
TLC27x 3 to 16 1100 675 1 1.7 3.6 — — S/D/Q
TLV237x 2.7 to 16 500 550 1 3 2.4 Yes I/O S/D/Q
TLC227x 2.7 to 16 300 1100 1 2.2 3.6 — O D/Q
TLV246x 2.7 to 6 150 550 1300 6.4 1.6 Yes I/O S/D/Q
TLV247x 2.7 to 6 250 600 2 2.8 1.5 Yes I/O S/D/Q
TLV244x 2.7 to 10 300 725 1 1.8 1.4 — O D/Q
(1) Typical values measured at 5 V, 25°C.