Dual 16V, 3MHz, 550-uA/ch, rail-to-rail output op amp
Exact equivalent in functionality and parametrics to the compared device:
Product details
Parameters
Package | Pins | Size
Features
- Rail-to-Rail Output
- Wide Bandwidth: 3 MHz
- High Slew Rate: 2.4 V/µs
- Supply Voltage Range: 2.7 V to 16 V
- Supply Current: 550 µA/Channel
- Input Noise Voltage: 39 nV/√Hz
- Input Bias Current: 1 pA
- Specified Temperature Range:
- Commercial Grade: 0°C to 70°C
- Industrial Grade: –40°C to 125°C
- Ultrasmall Packaging:
- 5-Pin SOT-23 (TLV271)
- 8-Pin MSOP (TLV272)
- Ideal Upgrade for TLC72x Family
Description
Operating from 2.7 V to 16 V over the extended industrial temperature range from –40°C to +125°C, the TLV27x is a low power, wide bandwidth operational amplifier (opamp) with rail to rail output. This makes it an ideal alternative to the TLC27x family for applications where rail-to-rail output swings are essential. The TLV27x provides 3-MHz bandwidth from only 550 µA.
Like the TLC27x, the TLV27x is fully specified for 5-V and ±5-V supplies. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from a variety of rechargeable cells (±8 V supplies down to ±1.35 V).
The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an attractive alternative for the TLC27x in battery-powered applications.
All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package.
The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range of many micropower microcontrollers available today including TIs MSP430.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TLV27x Family of 550-µA/Ch, 3-MHz, Rail-to-Rail Output Operational Amplifiers datasheet (Rev. E) | Nov. 30, 2016 |
Technical article | What is an op amp? | Jan. 21, 2020 | |
Technical article | How to lay out a PCB for high-performance, low-side current-sensing designs | Feb. 06, 2018 | |
Technical article | Low-side current sensing for high-performance cost-sensitive applications | Jan. 22, 2018 | |
Technical article | Voltage and current sensing in HEV/EV applications | Nov. 22, 2017 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | Mar. 28, 2017 | |
Application note | TLV271, TLV272, TLV274 EMI Immunity Performance | Dec. 19, 2012 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
Features
- 10 circuit configurations to choose from: Non-Inverting, Inverting, Active Filters, Difference Amplifier with Reference Buffer, and more!
- Multiple interface options: SMA, Header, Breadboard, Wire
- Designed for 0805 size components; 0603 size friendly
- Circuit schematic provided in silkscreen on the back (...)
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Features
- Expedites circuit design with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs)
- Noise calculations
- Common unit translation
- Solves common amplifier circuit design problems
- Gain selections using standard resistors
- Filter configurations
- Total noise for common amplifier configurations
- (...)
Reference designs
Design files
-
download PMP10594 BOM.pdf (104KB) -
download PMP10594 Assembly Drawing.pdf (151KB) -
download PMP10594 PCB.pdf (1098KB) -
download PMP10594 CAD Files.zip (963KB) -
download PMP10594 Gerber.zip (306KB)
Design files
-
download PMP11228 BOM.pdf (105KB) -
download PMP11228 Assembly Drawing.pdf (47KB) -
download PMP11228 PCB.pdf (184KB) -
download PMP11228 Altium.zip (1853KB) -
download PMP11228 Gerber.zip (176KB)
Design files
-
download PMP8973 BOM.pdf (82KB) -
download PMP8973 Assembly Drawing.pdf (150KB) -
download PMP8973 Gerber.zip (222KB)
Design files
-
download PMP7246 BOM.pdf (29KB) -
download PMP7246 Gerber.zip (216KB)
Design files
-
download PMP8948 Bill of Materials.pdf (21KB) -
download PMP8948 Gerber.zip (198KB) -
download PMP8948 PCB.pdf (1956KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
PDIP (P) | 8 | View options |
SOIC (D) | 8 | View options |
VSSOP (DGK) | 8 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.