10 Revision History
Changes from Revision C (April 2023) to Revision D (January 2025)
- Removed TLV3012-Q1 DCK Package Only Absolute Maximum table (combined into one table)Go
- Removed TLV3012-Q1 DCK Package Only Thermal Information table (combined into one table)Go
- Removed TLV3012-Q1 DCK Package Only Electrical Characteristics table (combined into one table)Go
- Removed TLV3012-Q1 DCK Package Only Switching Characteristics table (combined into one table)Go
- Removed TLV3012-Q1 DCK ackage Only Typical Characteristics curvesGo
- Changed the front page Device Information table title to Package Information
Go
- Updated Supply Current GraphsGo
Changes from Revision B (August 2022) to Revision C (April 2023)
- Added TLV3011B-Q1 and TLV3012B-Q1 to front page text and tables.Go
Changes from Revision A (June 2019) to Revision B (August 2022)
- Added TLV3011-Q1 in both DBV and DCK PackagesGo
- Added TLV3012-Q1 in SOT-23 (DBV)Go
- Added new tables for DBV packagesGo
- Updated the numbering format for tables, figures, and cross-references throughout the documentGo
Changes from Revision * (March 2011) to Revision A (June 2019)
- Added the HBM and CDM ESD ratings and classification levels. Also added the AEC-Q100 device temperature grade Go
- Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
- Deleted the TLV3011-Q1 device from the data sheet and removed A from the TLV3012-Q1 part number Go
- Deleted the Package Ordering Information sectionGo