SLVSJH6B July   2025  – December 2025 TLV3214-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Configuration: TLV3211-Q1, TLV3221-Q1
    2. 4.2 Pin Configurations: TLV3212-Q1, TLV3222-Q1
    3. 4.3 Pin Configurations: TLV3214-Q1
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - Single
    5. 5.5 Thermal Information - Dual
    6. 5.6 Thermal Information - Quad
    7. 5.7 Electrical Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Inputs
        1. 6.4.1.1 Unused Inputs
      2. 6.4.2 Internal Hysteresis
      3. 6.4.3 Outputs
        1. 6.4.3.1 Push-Pull Output
        2. 6.4.3.2 Open Drain Output
      4. 6.4.4 ESD Protection
      5. 6.4.5 Power-On Reset (POR)
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
      2. 7.1.2 External Hysteresis
        1. 7.1.2.1 Inverting Comparator With Hysteresis
        2. 7.1.2.2 Non-Inverting Comparator With Hysteresis
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information - Dual

THERMAL METRIC (1) TLV3212-Q1, TLV3222-Q1 UNIT
DGK (VSSOP) DSG (WSON) D (SOIC)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 141.7 – – °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.9 – – °C/W
RθJB Junction-to-board thermal resistance 78.8 – – °C/W
ΨJT Junction-to-top characterization parameter 6.0 – – °C/W
ΨJB Junction-to-board characterization parameter 78.1 – – °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – – – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.