SBOSA91B December   2021  – December 2023 TLV2387 , TLV387 , TLV4387

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 ESD Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information: TLV387
   5. 5.5 Thermal Information: TLV2387
   6. 5.6 Thermal Information: TLV4387
   7. 5.7 Electrical Characteristics
   8. 5.8 Typical Characteristics
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Input Bias Current
      2. 6.3.2 EMI Susceptibility and Input Filtering
   4. 6.4 Device Functional Modes
8. 7 Application and Implementation
   1. 7.1 Application Information
      1. 7.1.1 Zero-Drift Clocking
   2. 7.2 Typical Applications
      1. 7.2.1 Bidirectional Current Sensing
         1. 7.2.1.1 Design Requirements
         2. 7.2.1.2 Detailed Design Procedure
         3. 7.2.1.3 Application Curve
      2. 7.2.2 Load Cell Measurement
   3. 7.3 Power Supply Recommendations
   4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
9. 8 Device and Documentation Support
   1. 8.1 Device Support
      1. 8.1.1 Development Support
         1. 8.1.1.1 PSpice® for TI
         2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
   2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
   3. 8.3 Receiving Notification of Documentation Updates
   4. 8.4 Support Resources
   5. 8.5 Trademarks
   6. 8.6 Electrostatic Discharge Caution
   7. 8.7 Glossary
10. 9 Revision History
11. 10Mechanical, Packaging, and Orderable Information