SBVS283F August   2016  – October 2020 TLV733P-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown and Output Enable
      3. 7.3.3 Internal Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Selection
      2. 8.1.2 Dropout Voltage
    2. 8.2 Typical Applications
      1. 8.2.1 DC-DC Converter Post Regulation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Design Considerations
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Capacitor-Free Operation from a Battery Input Supply
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Design Considerations
        3. 8.2.2.3 Application Curve
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Examples
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Evaluation Module
      2. 10.1.2 Device Nomenclature
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TLV733P-Q1UNIT
DRV (WSON)DBV (SOT-23)
6 PINS5 PINS
RθJAJunction-to-ambient thermal resistance92.5198.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance123.9118.4°C/W
RθJBJunction-to-board thermal resistance61.965.8°C/W
ψJTJunction-to-top characterization parameter9.742.4°C/W
ψJBJunction-to-board characterization parameter62.365.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance30.9n/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.