SBOS986B October   2019  – May 2020 TLV9151 , TLV9152 , TLV9154

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      TLV915x in a Single-Pole, Low-Pass Filter
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions: TLV9151
    2.     Pin Functions: TLV9151S
    3.     Pin Functions: TLV9152
    4.     Pin Functions: TLV9152S
    5.     Pin Functions: TLV9154
    6.     Pin Functions: TLV9154S
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  EMI Rejection
      2. 7.3.2  Thermal Protection
      3. 7.3.3  Capacitive Load and Stability
      4. 7.3.4  Common-Mode Voltage Range
      5. 7.3.5  Phase Reversal Protection
      6. 7.3.6  Electrical Overstress
      7. 7.3.7  Overload Recovery
      8. 7.3.8  Typical Specifications and Distributions
      9. 7.3.9  Packages With an Exposed Thermal Pad
      10. 7.3.10 Shutdown
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Side Current Measurement
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Low offset voltage: ±125 µV
  • Low offset voltage drift: ±0.3 µV/°C
  • Low noise: 10.5 nV/√Hz at 1 kHz
  • High common-mode rejection: 120 dB
  • Low bias current: ±10 pA
  • Rail-to-rail input and output
  • Wide bandwidth: 4.5-MHz GBW
  • High slew rate: 20 V/µs
  • Low quiescent current: 560 µA per amplifier
  • Wide supply: ±1.35 V to ±8 V, 2.7 V to 16 V
  • Robust EMIRR performance: EMI/RFI filters on input pins
  • Differential and common-mode input voltage range to supply rail
  • Industry standard packages:
    • Single in SOT-23-5, SC70-5, and SOT553
    • Dual in SOIC-8, SOT-23-8, TSSOP-8, VSSOP-8, WSON-8, and X2QFN-10
    • Quad in SOIC-14, TSSOP-14, WQFN-14, and WQFN-16