SBOSA23D May   2020  – September 2021 TLV9151-Q1 , TLV9152-Q1 , TLV9154-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 EMI Rejection
      2. 7.3.2 Thermal Protection
      3. 7.3.3 Capacitive Load and Stability
      4. 7.3.4 Common-Mode Voltage Range
      5. 7.3.5 Phase Reversal Protection
      6. 7.3.6 Electrical Overstress
      7. 7.3.7 Overload Recovery
      8. 7.3.8 Typical Specifications and Distributions
      9. 7.3.9 Packages With an Exposed Thermal Pad
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Side Current Measurement
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5.     Trademarks
    6. 11.5 Electrostatic Discharge Caution
    7. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information for Single Channel

THERMAL METRIC (1) TLV9151-Q1 UNIT
DBV
(SOT-23)
5 PINS
RθJA Junction-to-ambient thermal resistance 187.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 86.2 °C/W
RθJB Junction-to-board thermal resistance 54.6 °C/W
ψJT Junction-to-top characterization parameter 27.8 °C/W
ψJB Junction-to-board characterization parameter 54.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.