SBOS820C September   2019  – June 2025 TMCS1100

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Typical Characteristics
      1. 6.10.1 Insulation Characteristics Curves
  8. 7 Parameter Measurement Information
    1. 7.1 Accuracy Parameters
      1. 7.1.1 Sensitivity Error
      2. 7.1.2 Offset Error and Offset Error Drift
      3. 7.1.3 Nonlinearity Error
      4. 7.1.4 Power Supply Rejection Ratio
      5. 7.1.5 Common-Mode Rejection Ratio
      6. 7.1.6 Reference Voltage Rejection Ratio
      7. 7.1.7 External Magnetic Field Errors
    2. 7.2 Transient Response Parameters
      1. 7.2.1 Slew Rate
      2. 7.2.2 Propagation Delay and Response Time
      3. 7.2.3 Current Overload Parameters
      4. 7.2.4 CMTI, Common-Mode Transient Immunity
    3. 7.3 Safe Operating Area
      1. 7.3.1 Continuous DC or Sinusoidal AC Current
      2. 7.3.2 Repetitive Pulsed Current SOA
      3. 7.3.3 Single Event Current Capability
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Input
      2. 8.3.2 Input Isolation
      3. 8.3.3 High-Precision Signal Chain
        1. 8.3.3.1 Temperature Stability
        2. 8.3.3.2 Lifetime and Environmental Stability
        3. 8.3.3.3 Frequency Response
        4. 8.3.3.4 Transient Response
      4. 8.3.4 External Reference Voltage Input
      5. 8.3.5 Current-Sensing Measurable Ranges
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Behavior
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Total Error Calculation Examples
        1. 9.1.1.1 Room Temperature Error Calculations
        2. 9.1.1.2 Full Temperature Range Error Calculations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Device Comparison

Table 4-1 Device Comparison
PRODUCT SENSITIVITY BIDIRECTIONAL LINEAR MEASUREMENT RANGE, VREF = VS / 2(1) UNIDIRECTIONAL LINEAR MEASUREMENT RANGE, VREF = VGND(1)
ΔVOUT / ΔIIN+, IN– VS = 5V VS = 3.3V VS = 5V VS = 3.3V
TMCS1100A1 50mV/A ±46A(2) ±29A(2) 1A to 96A(2) 1A to 62A(2)
TMCS1100A2 100mV/A ±23A(2) ±14.5A 0.5A to 48A(2) 0.5A to 31A(2)
TMCS1100A3 200mV/A ±11.5A ±7.25A 0.25A to 24A(2) 0.25A to 15.5A
TMCS1100A4 400mV/A ±5.75A -- 0.125A to 12A --
(1) Linear range limited by swing to supply and ground.
(2) Current levels must remain below both allowable continuous DC/RMS and transient peak current safe operating areas to not exceed device thermal limits. See the Safe Operating Area section.