SBOS825E September   2019  – June 2025 TMCS1101

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Typical Characteristics
      1. 6.10.1 Insulation Characteristics Curves
  8. 7 Parameter Measurement Information
    1. 7.1 Accuracy Parameters
      1. 7.1.1 Sensitivity Error
      2. 7.1.2 Offset Error and Offset Error Drift
      3. 7.1.3 Nonlinearity Error
      4. 7.1.4 Power Supply Rejection Ratio
      5. 7.1.5 Common-Mode Rejection Ratio
      6. 7.1.6 External Magnetic Field Errors
    2. 7.2 Transient Response Parameters
      1. 7.2.1 Slew Rate
      2. 7.2.2 Propagation Delay and Response Time
      3. 7.2.3 Current Overload Parameters
      4. 7.2.4 CMTI, Common-Mode Transient Immunity
    3. 7.3 Safe Operating Area
      1. 7.3.1 Continuous DC or Sinusoidal AC Current
      2. 7.3.2 Repetitive Pulsed Current SOA
      3. 7.3.3 Single Event Current Capability
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Input
      2. 8.3.2 Input Isolation
      3. 8.3.3 High-Precision Signal Chain
        1. 8.3.3.1 Temperature Stability
        2. 8.3.3.2 Lifetime and Environmental Stability
        3. 8.3.3.3 Frequency Response
        4. 8.3.3.4 Transient Response
      4. 8.3.4 Internal Reference Voltage
      5. 8.3.5 Current-Sensing Measurable Ranges
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Behavior
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Total Error Calculation Examples
        1. 9.1.1.1 Room Temperature Error Calculations
        2. 9.1.1.2 Full Temperature Range Error Calculations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.10 Typical Characteristics

TMCS1101 TMCS1101AxB Sensitivity Error vs Temperature
Figure 6-1 TMCS1101AxB Sensitivity Error vs Temperature
TMCS1101 TMCS1101AxB Input Offset Current vs Temperature
Figure 6-3 TMCS1101AxB Input Offset Current vs Temperature
TMCS1101 Non-Linearity vs Temperature
Figure 6-5 Non-Linearity vs Temperature
TMCS1101 Sensitivity Error Production Distribution
TMCS1101AxB
Figure 6-7 Sensitivity Error Production Distribution
TMCS1101 Input Offset Current Production Distribution
TMCS1101A1B
Figure 6-9 Input Offset Current Production Distribution
TMCS1101 Input Offset Current Production Distribution
TMCS1101A2B
Figure 6-11 Input Offset Current Production Distribution
TMCS1101 Input Offset Current Production Distribution
TMCS1101A3B
Figure 6-13 Input Offset Current Production Distribution
TMCS1101 Input Offset Current Production Distribution
TMCS1101A4B
Figure 6-15 Input Offset Current Production Distribution
TMCS1101 Sensitivity vs Frequency, All Gains Normalized to 1Hz
Figure 6-17 Sensitivity vs Frequency, All Gains Normalized to 1Hz
TMCS1101 Output Swing vs Output Current

 

Figure 6-19 Output Swing vs Output Current
TMCS1101 Quiescent Current vs Temperature
Figure 6-21 Quiescent Current vs Temperature
TMCS1101 Voltage Output Step, Rising
Figure 6-23 Voltage Output Step, Rising
TMCS1101 Current Overload Response
Figure 6-25 Current Overload Response
TMCS1101 Input Conductor Resistance vs Temperature
Figure 6-27 Input Conductor Resistance vs Temperature
TMCS1101 TMCS1101AxU Sensitivity Error vs Temperature
Figure 6-2 TMCS1101AxU Sensitivity Error vs Temperature
TMCS1101 TMCS1101AxU Input Offset Current vs Temperature
Figure 6-4 TMCS1101AxU Input Offset Current vs Temperature
TMCS1101 Non-Linearity vs Temperature
TMCS1101AxU
Figure 6-6 Non-Linearity vs Temperature
TMCS1101 Sensitivity Error Production Distribution
TMCS1101AxU
Figure 6-8 Sensitivity Error Production Distribution
TMCS1101 Input Offset Current Production Distribution
TMCS1101A1U
Figure 6-10 Input Offset Current Production Distribution
TMCS1101 Input Offset Current Production Distribution
TMCS1101A2U
Figure 6-12 Input Offset Current Production Distribution
TMCS1101 Input Offset Current Production Distribution
TMCS1101A3U
Figure 6-14 Input Offset Current Production Distribution
TMCS1101 Input Offset Current Production Distribution
TMCS1101A4U
Figure 6-16 Input Offset Current Production Distribution
TMCS1101 Phase vs Frequency, All Gains
Figure 6-18 Phase vs Frequency, All Gains
TMCS1101 Output Impedance vs Frequency
Figure 6-20 Output Impedance vs Frequency
TMCS1101 Input-Referred Noise vs Frequency
Figure 6-22 Input-Referred Noise vs Frequency
TMCS1101 Voltage Output Step, Falling
Figure 6-24 Voltage Output Step, Falling
TMCS1101 Startup Transient Response
Figure 6-26 Startup Transient Response