SLASE75D August   2015  – September 2017 TMDS181

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Electrical Characteristics
    6. 6.6  TMDS Differential Input Electrical Characteristics
    7. 6.7  TMDS Differential Output Electrical Characteristics
    8. 6.8  DDC, I2C, HPD, and ARC Electrical Characteristics
    9. 6.9  Power-Up and Operation Timing Requirements
    10. 6.10 TMDS Switching Characteristics
    11. 6.11 HPD Switching Characteristics
    12. 6.12 DDC and I2C Switching Characteristics
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Reset Implementation
      2. 8.3.2  Operation Timing
      3. 8.3.3  Swap and Polarity Working
      4. 8.3.4  TMDS Inputs
      5. 8.3.5  TMDS Inputs Debug Tools
      6. 8.3.6  Receiver Equalizer
      7. 8.3.7  Input Signal Detect Block
      8. 8.3.8  Audio Return Channel
      9. 8.3.9  Transmitter Impedance Control
      10. 8.3.10 TMDS Outputs
      11. 8.3.11 Pre-Emphasis/De-Emphasis
    4. 8.4 Device Functional Modes
      1. 8.4.1 Retimer Mode
      2. 8.4.2 Redriver Mode
      3. 8.4.3 DDC Training for HDMI2.0a Data Rate Monitor
      4. 8.4.4 DDC Functional Description
      5. 8.4.5 Mode Selection Functional Description
    5. 8.5 Register Maps
      1. 8.5.1 Local I2C Overview
      2. 8.5.2 Local I2C Control Bit Access TAG Convention
      3. 8.5.3 CSR Bit Field Definitions
        1. 8.5.3.1 ID Registers
        2. 8.5.3.2 MISC CONTROL Register
        3. 8.5.3.3 Equalization Control Register
        4. 8.5.3.4 RX PATTERN VERIFIER CONTROL/STATUS Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Source Side Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Sink Side Application
      3. 9.2.3 Application Chain Showing DDC Connections
        1. 9.2.3.1 Detailed Design Procedure
          1. 9.2.3.1.1 DDC Pullup Resistors
          2. 9.2.3.1.2 Compliance Testing
            1. 9.2.3.1.2.1 Pin Strapping Configuration for HDMI2.0a and HDMI1.4b
            2. 9.2.3.1.2.2 I2C Control for HDMI2.0a and HDMI1.4b
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.