SBOS231I January   2002  – November 2015 TMP100 , TMP101

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading to the TMP100 and TMP101
        4. 7.3.2.4 Slave Mode Operations
          1. 7.3.2.4.1 Slave Receiver Mode
          2. 7.3.2.4.2 Slave Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed Mode
        8. 7.3.2.8 POR (Power-On Reset)
      3. 7.3.3 Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 OS/ALERT (OS)
      3. 7.4.3 Thermostat Mode (TM)
        1. 7.4.3.1 Comparator Mode (TM = 0)
        2. 7.4.3.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
        1. 7.5.1.1 Pointer Register Byte (pointer = N/A) [reset = 00h]
        2. 7.5.1.2 Pointer Addresses of the TMP100 and TMP101 Registers
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1, F0)
        5. 7.5.3.5 Converter Resolution (R1, R0)
        6. 7.5.3.6 OS/ALERT (OS)
      4. 7.5.4 High- and Low-Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power supply, V+ 7.5 V
Input voltage(2) –0.5 7.5 V
Operating temperature –55 125 °C
Junction temperature, TJ 150 °C
Storage temperature, Tstg –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input voltage rating applies to all TMP100 and TMP101 input voltages.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage 2.7 5.5 V
Operating free-air temperature, TA –55 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TMP100, TMP101 UNIT
DBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 182.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 115 °C/W
RθJB Junction-to-board thermal resistance 30.2 °C/W
ψJT Junction-to-top characterization parameter 17.1 °C/W
ψJB Junction-to-board characterization parameter 29.7 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

At TA = −55°C to 125°C and V+ = 2.7 V to 5.5 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE INPUT
Range –55 125 °C
Accuracy (temperature error) −25°C to 85°C ±0.5 ±2 °C
−55°C to 125°C ±1 ±2
Accuracy (temperature error) vs supply 0.2 ±0.5 °C/V
Resolution Selectable 0.0625 °C
DIGITAL INPUT/OUTPUT
Input capacitance 3 pF
VIH High-level input logic 0.7 (V+) 6 V
VIL Low-level input logic −0.5 0.3 (V+) V
IIN Input current 0 V ≤ VIN ≤ 6 V 1 µA
VOL Low-level output logic SDA IOL = 3 mA 0 0.15 0.4 V
VOL Low-level output logic ALERT IOL = 4 mA 0 0.15 0.4 V
Resolution Selectable 9 12 Bits
Conversion time 9 bits 40 75 ms
10 bits 80 150
11 bits 160 300
12 bits 320 600
Conversion rate 9 bits 25 s/s
10 bits 12
11 bits 6
12 bits 3
POWER SUPPLY
Operating range 2.7 5.5 V
IQ Quiescent current Serial bus inactive 45 75 µA
Serial bus active, SCL frequency = 400 kHz 70
Serial bus active, SCL frequency = 3.4 MHz 150
ISD Shutdown current Serial bus inactive 0.1 13 µA
Serial bus active, SCL frequency = 400 kHz 20
Serial bus active, SCL frequency = 3.4 MHz 100
TEMPERATURE RANGE
Specified range –55 125 °C
Storage range –60 150 °C

6.6 Timing Requirements

PARAMETER FAST MODE HIGH-SPEED MODE UNIT
MIN MAX MIN MAX
f(SCL) SCL operating frequency 0.4 2 MHz
t(BUF) Bus free time between STOP and START condition 1300 160 ns
t(HDSTA) Hold time after repeated START condition.
After this period, the first clock is generated.		 600 160 ns
t(SUSTA) Repeated START condition setup time 600 160 ns
t(SUSTO) STOP condition setup time 600 160 ns
t(HDDAT) Data hold time 20 900 20 170 ns
t(SUDAT) Data setup time 100 20 ns
t(LOW) SCL clock LOW period 1300 360 ns
t(HIGH) SCL clock HIGH period 600 60 ns
tRC, tFC Clock rise and fall time 300 40 ns
tRD, tFD Data rise and fall time 300 170 ns

6.7 Typical Characteristics

At TA = 25°C and V+ = 5 V, unless otherwise noted.
TMP100 TMP101 graph_1_sbos231.gif
Figure 1. Quiescent Current vs Temperature
TMP100 TMP101 graph_3_sbos231.gif
Figure 3. Conversion Time vs Temperature
TMP100 TMP101 graph_5_sbos231.gif
Figure 5. Quiescent Current With Bus Activity vs Temperature
TMP100 TMP101 graph_2_sbos231.gif
Figure 2. Shutdown Current vs Temperature
TMP100 TMP101 graph_4_sbos231.gif
Figure 4. Temperature Accuracy vs Temperature