SBOSA41A May   2023  – September 2023 TMP4718

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 1.2-V Logic Compatible Inputs
      2. 8.3.2 Series Resistance Cancellation
      3. 8.3.3 Device Initialization, Resistor Decoding, and Default Temperature Conversion
      4. 8.3.4 Adjustable Default T_CRIT High-Temperature Limit
      5. 8.3.5 ALERT and T_CRIT Output
      6. 8.3.6 Fault Queue
      7. 8.3.7 Filtering
      8. 8.3.8 One-Shot Conversions
    4. 8.4 Device Functional Modes
      1. 8.4.1 Interrupt and Comparator Mode
        1. 8.4.1.1 Interrupt Mode
        2. 8.4.1.2 Comparator Mode
        3. 8.4.1.3 T_CRIT Output
      2. 8.4.2 Shutdown Mode
      3. 8.4.3 Continuous Conversion Mode
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 I2C and SMBus Interface
      3. 8.5.3 Device Address
      4. 8.5.4 Bus Transactions
        1. 8.5.4.1 Writes
        2. 8.5.4.2 Reads
      5. 8.5.5 SMBus Alert Mode
    6. 8.6 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TMP4718 UNIT
DGK (VSSOP)
6 PINS
RθJA Junction-to-ambient thermal resistance 185.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76.3 °C/W
RθJB Junction-to-board thermal resistance 107.5 °C/W
ψJT Junction-to-top characterization parameter 16.8 °C/W
ψJB Junction-to-board characterization parameter 105.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note, SPRA953.