SPRS880L December   2013  – March 2020 TMS320F28374D , TMS320F28375D , TMS320F28376D , TMS320F28377D , TMS320F28378D , TMS320F28379D

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
    3. 4.3 Pins With Internal Pullup and Pulldown
    4. 4.4 Pin Multiplexing
      1. 4.4.1 GPIO Muxed Pins
      2. 4.4.2 Input X-BAR
      3. 4.4.3 Output X-BAR and ePWM X-BAR
      4. 4.4.4 USB Pin Muxing
      5. 4.4.5 High-Speed SPI Pin Muxing
    5. 4.5 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Commercial
    3. 5.3  ESD Ratings – Automotive
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 Device Current Consumption at 200-MHz SYSCLK
      2. 5.5.1     Current Consumption Graphs
      3. 5.5.2     Reducing Current Consumption
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics
      1. 5.7.1 ZWT Package
      2. 5.7.2 PTP Package
      3. 5.7.3 PZP Package
    8. 5.8  Thermal Design Considerations
    9. 5.9  System
      1. 5.9.1 Power Sequencing
        1. 5.9.1.1 Signal Pin Requirements
        2. 5.9.1.2 VDDIO, VDDA, VDD3VFL, and VDDOSC Requirements
        3. 5.9.1.3 VDD Requirements
        4. 5.9.1.4 Supply Ramp Rate
          1. Table 5-3 Supply Ramp Rate
        5. 5.9.1.5 Supply Supervision
      2. 5.9.2 Reset Timing
        1. 5.9.2.1 Reset Sources
        2. 5.9.2.2 Reset Electrical Data and Timing
          1. Table 5-4 Reset (XRS) Timing Requirements
          2. Table 5-5 Reset (XRS) Switching Characteristics
      3. 5.9.3 Clock Specifications
        1. 5.9.3.1 Clock Sources
        2. 5.9.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 5.9.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
            1. Table 5-7  Input Clock Frequency
            2. Table 5-8  X1 Input Level Characteristics When Using an External Clock Source (Not a Crystal)
            3. Table 5-9  X1 Timing Requirements
            4. Table 5-10 AUXCLKIN Timing Requirements
            5. Table 5-11 PLL Lock Times
          2. 5.9.3.2.2 Internal Clock Frequencies
            1. Table 5-12 Internal Clock Frequencies
          3. 5.9.3.2.3 Output Clock Frequency and Switching Characteristics
            1. Table 5-13 Output Clock Frequency
            2. Table 5-14 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
        3. 5.9.3.3 Input Clocks and PLLs
        4. 5.9.3.4 Crystal Oscillator
          1. Table 5-15 Crystal Oscillator Parameters
          2. Table 5-17 Crystal Oscillator Electrical Characteristics
        5. 5.9.3.5 Internal Oscillators
          1. Table 5-18 Internal Oscillator Electrical Characteristics
      4. 5.9.4 Flash Parameters
        1. Table 5-20 Flash Parameters
      5. 5.9.5 Emulation/JTAG
        1. 5.9.5.1 JTAG Electrical Data and Timing
          1. Table 5-21 JTAG Timing Requirements
          2. Table 5-22 JTAG Switching Characteristics
      6. 5.9.6 GPIO Electrical Data and Timing
        1. 5.9.6.1 GPIO - Output Timing
          1. Table 5-23 General-Purpose Output Switching Characteristics
        2. 5.9.6.2 GPIO - Input Timing
          1. Table 5-24 General-Purpose Input Timing Requirements
        3. 5.9.6.3 Sampling Window Width for Input Signals
      7. 5.9.7 Interrupts
        1. 5.9.7.1 External Interrupt (XINT) Electrical Data and Timing
          1. Table 5-25 External Interrupt Timing Requirements
          2. Table 5-26 External Interrupt Switching Characteristics
      8. 5.9.8 Low-Power Modes
        1. 5.9.8.1 Clock-Gating Low-Power Modes
        2. 5.9.8.2 Power-Gating Low-Power Modes
        3. 5.9.8.3 Low-Power Mode Wakeup Timing
          1. Table 5-29 IDLE Mode Timing Requirements
          2. Table 5-30 IDLE Mode Switching Characteristics
          3. Table 5-31 STANDBY Mode Timing Requirements
          4. Table 5-32 STANDBY Mode Switching Characteristics
          5. Table 5-33 HALT Mode Timing Requirements
          6. Table 5-34 HALT Mode Switching Characteristics
          7. Table 5-35 HIBERNATE Mode Timing Requirements
          8. Table 5-36 HIBERNATE Mode Switching Characteristics
      9. 5.9.9 External Memory Interface (EMIF)
        1. 5.9.9.1 Asynchronous Memory Support
        2. 5.9.9.2 Synchronous DRAM Support
        3. 5.9.9.3 EMIF Electrical Data and Timing
          1. 5.9.9.3.1 Asynchronous RAM
            1. Table 5-37 EMIF Asynchronous Memory Timing Requirements
            2. Table 5-38 EMIF Asynchronous Memory Switching Characteristics
          2. 5.9.9.3.2 Synchronous RAM
            1. Table 5-39 EMIF Synchronous Memory Timing Requirements
            2. Table 5-40 EMIF Synchronous Memory Switching Characteristics
    10. 5.10 Analog Peripherals
      1. 5.10.1 Analog-to-Digital Converter (ADC)
        1. 5.10.1.1 ADC Configurability
          1. 5.10.1.1.1 Signal Mode
        2. 5.10.1.2 ADC Electrical Data and Timing
          1. Table 5-42 ADC Operating Conditions (16-Bit Differential Mode)
          2. Table 5-43 ADC Characteristics (16-Bit Differential Mode)
          3. Table 5-44 ADC Operating Conditions (12-Bit Single-Ended Mode)
          4. Table 5-45 ADC Characteristics (12-Bit Single-Ended Mode)
          5. Table 5-46 ADCEXTSOC Timing Requirements
          6. 5.10.1.2.1 ADC Input Models
            1. Table 5-47 Differential Input Model Parameters
            2. Table 5-48 Single-Ended Input Model Parameters
          7. 5.10.1.2.2 ADC Timing Diagrams
            1. Table 5-51 ADC Timings in 12-Bit Mode (SYSCLK Cycles)
            2. Table 5-52 ADC Timings in 16-Bit Mode
        3. 5.10.1.3 Temperature Sensor Electrical Data and Timing
          1. Table 5-53 Temperature Sensor Electrical Characteristics
      2. 5.10.2 Comparator Subsystem (CMPSS)
        1. 5.10.2.1 CMPSS Electrical Data and Timing
          1. Table 5-54 Comparator Electrical Characteristics
          2. Table 5-55 CMPSS DAC Static Electrical Characteristics
      3. 5.10.3 Buffered Digital-to-Analog Converter (DAC)
        1. 5.10.3.1 Buffered DAC Electrical Data and Timing
          1. Table 5-56 Buffered DAC Electrical Characteristics
    11. 5.11 Control Peripherals
      1. 5.11.1 Enhanced Capture (eCAP)
        1. 5.11.1.1 eCAP Electrical Data and Timing
          1. Table 5-57 eCAP Timing Requirement
          2. Table 5-58 eCAP Switching Characteristics
      2. 5.11.2 Enhanced Pulse Width Modulator (ePWM)
        1. 5.11.2.1 Control Peripherals Synchronization
        2. 5.11.2.2 ePWM Electrical Data and Timing
          1. Table 5-59 ePWM Timing Requirements
          2. Table 5-60 ePWM Switching Characteristics
          3. 5.11.2.2.1 Trip-Zone Input Timing
            1. Table 5-61 Trip-Zone Input Timing Requirements
        3. 5.11.2.3 External ADC Start-of-Conversion Electrical Data and Timing
          1. Table 5-62 External ADC Start-of-Conversion Switching Characteristics
      3. 5.11.3 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 5.11.3.1 eQEP Electrical Data and Timing
          1. Table 5-63 eQEP Timing Requirements
          2. Table 5-64 eQEP Switching Characteristics
      4. 5.11.4 High-Resolution Pulse Width Modulator (HRPWM)
        1. 5.11.4.1 HRPWM Electrical Data and Timing
          1. Table 5-65 High-Resolution PWM Timing Requirements
          2. Table 5-66 High-Resolution PWM Characteristics
      5. 5.11.5 Sigma-Delta Filter Module (SDFM)
        1. 5.11.5.1 SDFM Electrical Data and Timing (Using ASYNC)
          1. Table 5-67 SDFM Timing Requirements When Using Asynchronous GPIO (ASYNC) Option
        2. 5.11.5.2 SDFM Electrical Data and Timing (Using 3-Sample GPIO Input Qualification)
          1. Table 5-68 SDFM Timing Requirements When Using GPIO Input Qualification (3-Sample Window) Option
    12. 5.12 Communications Peripherals
      1. 5.12.1 Controller Area Network (CAN)
      2. 5.12.2 Inter-Integrated Circuit (I2C)
        1. 5.12.2.1 I2C Electrical Data and Timing
          1. Table 5-69 I2C Timing Requirements
          2. Table 5-70 I2C Switching Characteristics
      3. 5.12.3 Multichannel Buffered Serial Port (McBSP)
        1. 5.12.3.1 McBSP Electrical Data and Timing
          1. 5.12.3.1.1 McBSP Transmit and Receive Timing
            1. Table 5-71 McBSP Timing Requirements
            2. Table 5-72 McBSP Switching Characteristics
          2. 5.12.3.1.2 McBSP as SPI Master or Slave Timing
            1. Table 5-73 McBSP as SPI Master Timing Requirements
            2. Table 5-74 McBSP as SPI Master Switching Characteristics
            3. Table 5-75 McBSP as SPI Slave Timing Requirements
            4. Table 5-76 McBSP as SPI Slave Switching Characteristics
      4. 5.12.4 Serial Communications Interface (SCI)
      5. 5.12.5 Serial Peripheral Interface (SPI)
        1. 5.12.5.1 SPI Electrical Data and Timing
          1. 5.12.5.1.1 SPI Master Mode Timings
            1. Table 5-77 SPI Master Mode Timing Requirements
            2. Table 5-78 SPI Master Mode Switching Characteristics (Clock Phase = 0)
            3. Table 5-79 SPI Master Mode Switching Characteristics (Clock Phase = 1)
          2. 5.12.5.1.2 SPI Slave Mode Timings
            1. Table 5-80 SPI Slave Mode Timing Requirements
            2. Table 5-81 SPI Slave Mode Switching Characteristics
      6. 5.12.6 Universal Serial Bus (USB) Controller
        1. 5.12.6.1 USB Electrical Data and Timing
          1. Table 5-82 USB Input Ports DP and DM Timing Requirements
          2. Table 5-83 USB Output Ports DP and DM Switching Characteristics
      7. 5.12.7 Universal Parallel Port (uPP) Interface
        1. 5.12.7.1 uPP Electrical Data and Timing
          1. Table 5-84 uPP Timing Requirements
          2. Table 5-85 uPP Switching Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Memory
      1. 6.3.1 C28x Memory Map
      2. 6.3.2 Flash Memory Map
      3. 6.3.3 EMIF Chip Select Memory Map
      4. 6.3.4 Peripheral Registers Memory Map
      5. 6.3.5 Memory Types
        1. 6.3.5.1 Dedicated RAM (Mx and Dx RAM)
        2. 6.3.5.2 Local Shared RAM (LSx RAM)
        3. 6.3.5.3 Global Shared RAM (GSx RAM)
        4. 6.3.5.4 CPU Message RAM (CPU MSGRAM)
        5. 6.3.5.5 CLA Message RAM (CLA MSGRAM)
    4. 6.4  Identification
    5. 6.5  Bus Architecture – Peripheral Connectivity
    6. 6.6  C28x Processor
      1. 6.6.1 Floating-Point Unit
      2. 6.6.2 Trigonometric Math Unit
      3. 6.6.3 Viterbi, Complex Math, and CRC Unit II (VCU-II)
    7. 6.7  Control Law Accelerator
    8. 6.8  Direct Memory Access
    9. 6.9  Interprocessor Communication Module
    10. 6.10 Boot ROM and Peripheral Booting
      1. 6.10.1 EMU Boot or Emulation Boot
      2. 6.10.2 WAIT Boot Mode
      3. 6.10.3 Get Mode
      4. 6.10.4 Peripheral Pins Used by Bootloaders
    11. 6.11 Dual Code Security Module
    12. 6.12 Timers
    13. 6.13 Nonmaskable Interrupt With Watchdog Timer (NMIWD)
    14. 6.14 Watchdog
    15. 6.15 Configurable Logic Block (CLB)
    16. 6.16 Functional Safety
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Device and Development Support Tool Nomenclature
    2. 8.2 Markings
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Support Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZWT|337
  • PTP|176
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Diagrams

Figure 4-1 to Figure 4-4 show the terminal assignments on the 337-ball ZWT New Fine Pitch Ball Grid Array. Each figure shows a quadrant of the terminal assignments. Figure 4-5 shows the pin assignments on the 176-pin PTP PowerPAD Thermally Enhanced Low-Profile Quad Flatpack. Figure 4-6 shows the pin assignments on the 100-pin PZP PowerPAD Thermally Enhanced Thin Quad Flatpack.

TMS320F28379D TMS320F28378D TMS320F28377D TMS320F28376D TMS320F28375D TMS320F28374D pinmap_zwt337_quada_prs880.gif
Only the GPIO function is shown on GPIO terminals. See Table 4-1 for the complete, muxed signal name.
Figure 4-1 337-Ball ZWT New Fine Pitch Ball Grid Array (Bottom View) – [Quadrant A]
TMS320F28379D TMS320F28378D TMS320F28377D TMS320F28376D TMS320F28375D TMS320F28374D pinmap_zwt337_quadb_prs880.gif
Only the GPIO function is shown on GPIO terminals. See Table 4-1 for the complete, muxed signal name.
Figure 4-2 337-Ball ZWT New Fine Pitch Ball Grid Array (Bottom View) – [Quadrant B]
TMS320F28379D TMS320F28378D TMS320F28377D TMS320F28376D TMS320F28375D TMS320F28374D pinmap_zwt337_quadc_prs880.gif
Only the GPIO function is shown on GPIO terminals. See Table 4-1 for the complete, muxed signal name.
Figure 4-3 337-Ball ZWT New Fine Pitch Ball Grid Array (Bottom View) – [Quadrant C]
TMS320F28379D TMS320F28378D TMS320F28377D TMS320F28376D TMS320F28375D TMS320F28374D pinmap_zwt337_quadd_prs880.gif
Only the GPIO function is shown on GPIO terminals. See Table 4-1 for the complete, muxed signal name.
Figure 4-4 337-Ball ZWT New Fine Pitch Ball Grid Array (Bottom View) – [Quadrant D]
TMS320F28379D TMS320F28378D TMS320F28377D TMS320F28376D TMS320F28375D TMS320F28374D pinmap_ptp176_prs880.gif
Only the GPIO function is shown on GPIO pins. See Table 4-1 for the complete, muxed signal name.
Figure 4-5 176-Pin PTP PowerPAD Thermally Enhanced Low-Profile Quad Flatpack (Top View)
TMS320F28379D TMS320F28378D TMS320F28377D TMS320F28376D TMS320F28375D TMS320F28374D pinmap_pzp100_prs881.gif
Only the GPIO function is shown on GPIO pins. See Table 4-1 for the complete, muxed signal name.
Figure 4-6 100-Pin PZP PowerPAD HTQFP (Top View)

NOTE

The exposed lead frame die pad of the PowerPAD™ package serves two functions: to remove heat from the die and to provide ground path for the digital ground (analog ground is provided through dedicated pins). Thus, the PowerPAD should be soldered to the ground (GND) plane of the PCB because this will provide both the digital ground path and good thermal conduction path. To make optimum use of the thermal efficiencies designed into the PowerPAD package, the PCB must be designed with this technology in mind. A thermal land is required on the surface of the PCB directly underneath the body of the PowerPAD. The thermal land should be soldered to the exposed lead frame die pad of the PowerPAD package; the thermal land should be as large as needed to dissipate the required heat. An array of thermal vias should be used to connect the thermal pad to the internal GND plane of the board. See PowerPAD™ Thermally Enhanced Package for more details on using the PowerPAD package.

NOTE

PCB footprints and schematic symbols are available for download in a vendor-neutral format, which can be exported to the leading EDA CAD/CAE design tools. See the CAD/CAE Symbols section in the product folder for each device, under the Packaging section. These footprints and symbols can also be searched for at http://webench.ti.com/cad/.