SPRSP85 April   2024 TMS320F28P550SJ , TMS320F28P559SJ-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1 Analog Signals
      2. 5.3.2 Digital Signals
      3. 5.3.3 Power and Ground
      4. 5.3.4 Test, JTAG, and Reset
    4. 5.4 Pin Multiplexing
      1. 5.4.1 GPIO Muxed Pins
      2. 5.4.2 Digital Inputs on ADC Pins (AIOs)
      3. 5.4.3 Digital Inputs and Outputs on ADC Pins (AGPIOs)
      4. 5.4.4 GPIO Input X-BAR
      5. 5.4.5 GPIO Output X-BAR, CLB X-BAR, CLB Output X-BAR, and ePWM X-BAR
    5. 5.5 Pins With Internal Pullup and Pulldown
    6. 5.6 Connections for Unused Pins
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings – Commercial
    3. 6.3  ESD Ratings – Automotive
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Consumption Summary
      1. 6.5.1 System Current Consumption - VREG Enable - Internal Supply
      2. 6.5.2 System Current Consumption - VREG Disable - External Supply
      3. 6.5.3 Operating Mode Test Description
      4. 6.5.4 Reducing Current Consumption
        1. 6.5.4.1 Typical Current Reduction per Disabled Peripheral
    6. 6.6  Electrical Characteristics
    7. 6.7  Thermal Resistance Characteristics for PDT Package
    8. 6.8  Thermal Resistance Characteristics for PZ Package
    9. 6.9  Thermal Resistance Characteristics for PNA Package
    10. 6.10 Thermal Resistance Characteristics for PM Package
    11. 6.11 Thermal Resistance Characteristics for RSH Package
    12. 6.12 Thermal Design Considerations
    13. 6.13 System
      1. 6.13.1  Power Management Module (PMM)
        1. 6.13.1.1 Introduction
        2. 6.13.1.2 Overview
          1. 6.13.1.2.1 Power Rail Monitors
            1. 6.13.1.2.1.1 I/O POR (Power-On Reset) Monitor
            2. 6.13.1.2.1.2 I/O BOR (Brown-Out Reset) Monitor
            3. 6.13.1.2.1.3 VDD POR (Power-On Reset) Monitor
          2. 6.13.1.2.2 External Supervisor Usage
          3. 6.13.1.2.3 Delay Blocks
          4. 6.13.1.2.4 Internal 1.2-V LDO Voltage Regulator (VREG)
          5. 6.13.1.2.5 VREGENZ
        3. 6.13.1.3 External Components
          1. 6.13.1.3.1 Decoupling Capacitors
            1. 6.13.1.3.1.1 VDDIO Decoupling
            2. 6.13.1.3.1.2 VDD Decoupling
        4. 6.13.1.4 Power Sequencing
          1. 6.13.1.4.1 Supply Pins Ganging
          2. 6.13.1.4.2 Signal Pins Power Sequence
          3. 6.13.1.4.3 Supply Pins Power Sequence
            1. 6.13.1.4.3.1 External VREG/VDD Mode Sequence
            2. 6.13.1.4.3.2 Internal VREG/VDD Mode Sequence
            3. 6.13.1.4.3.3 Supply Sequencing Summary and Effects of Violations
            4. 6.13.1.4.3.4 Supply Slew Rate
        5. 6.13.1.5 Power Management Module Electrical Data and Timing
          1. 6.13.1.5.1 Power Management Module Operating Conditions
          2. 6.13.1.5.2 Power Management Module Characteristics
      2. 6.13.2  Reset Timing
        1. 6.13.2.1 Reset Sources
        2. 6.13.2.2 Reset Electrical Data and Timing
          1. 6.13.2.2.1 Reset - XRSn - Timing Requirements
          2. 6.13.2.2.2 Reset - XRSn - Switching Characteristics
          3. 6.13.2.2.3 Reset Timing Diagrams
      3. 6.13.3  Clock Specifications
        1. 6.13.3.1 Clock Sources
        2. 6.13.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 6.13.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
            1. 6.13.3.2.1.1 Input Clock Frequency
            2. 6.13.3.2.1.2 XTAL Oscillator Characteristics
            3. 6.13.3.2.1.3 X1 Input Level Characteristics When Using an External Clock Source - Not a Crystal
            4. 6.13.3.2.1.4 X1 Timing Requirements
            5. 6.13.3.2.1.5 AUXCLKIN Timing Requirements
            6. 6.13.3.2.1.6 APLL Characteristics
            7. 6.13.3.2.1.7 XCLKOUT Switching Characteristics - PLL Bypassed or Enabled
            8. 6.13.3.2.1.8 Internal Clock Frequencies
        3. 6.13.3.3 Input Clocks and PLLs
        4. 6.13.3.4 XTAL Oscillator
          1. 6.13.3.4.1 Introduction
          2. 6.13.3.4.2 Overview
            1. 6.13.3.4.2.1 Electrical Oscillator
              1. 6.13.3.4.2.1.1 Modes of Operation
                1. 6.13.3.4.2.1.1.1 Crystal Mode of Operation
                2. 6.13.3.4.2.1.1.2 Single-Ended Mode of Operation
              2. 6.13.3.4.2.1.2 XTAL Output on XCLKOUT
            2. 6.13.3.4.2.2 Quartz Crystal
            3. 6.13.3.4.2.3 GPIO Modes of Operation
          3. 6.13.3.4.3 Functional Operation
            1. 6.13.3.4.3.1 ESR – Effective Series Resistance
            2. 6.13.3.4.3.2 Rneg – Negative Resistance
            3. 6.13.3.4.3.3 Start-up Time
              1. 6.13.3.4.3.3.1 X1/X2 Precondition
            4. 6.13.3.4.3.4 DL – Drive Level
          4. 6.13.3.4.4 How to Choose a Crystal
          5. 6.13.3.4.5 Testing
          6. 6.13.3.4.6 Common Problems and Debug Tips
          7. 6.13.3.4.7 Crystal Oscillator Specifications
            1. 6.13.3.4.7.1 Crystal Oscillator Electrical Characteristics
            2. 6.13.3.4.7.2 Crystal Equivalent Series Resistance (ESR) Requirements
            3. 6.13.3.4.7.3 Crystal Oscillator Parameters
            4. 6.13.3.4.7.4 Crystal Oscillator Electrical Characteristics
        5. 6.13.3.5 Internal Oscillators
          1. 6.13.3.5.1 INTOSC Characteristics
      4. 6.13.4  Flash Parameters
        1. 6.13.4.1 Flash Parameters 
      5. 6.13.5  RAM Specifications
      6. 6.13.6  ROM Specifications
      7. 6.13.7  Emulation/JTAG
        1. 6.13.7.1 JTAG Electrical Data and Timing
          1. 6.13.7.1.1 JTAG Timing Requirements
          2. 6.13.7.1.2 JTAG Switching Characteristics
          3. 6.13.7.1.3 JTAG Timing Diagram
        2. 6.13.7.2 cJTAG Electrical Data and Timing
          1. 6.13.7.2.1 cJTAG Timing Requirements
          2. 6.13.7.2.2 cJTAG Switching Characteristics
          3. 6.13.7.2.3 cJTAG Timing Diagram
      8. 6.13.8  GPIO Electrical Data and Timing
        1. 6.13.8.1 GPIO – Output Timing
          1. 6.13.8.1.1 General-Purpose Output Switching Characteristics
          2. 6.13.8.1.2 General-Purpose Output Timing Diagram
        2. 6.13.8.2 GPIO – Input Timing
          1. 6.13.8.2.1 General-Purpose Input Timing Requirements
          2. 6.13.8.2.2 Sampling Mode
        3. 6.13.8.3 Sampling Window Width for Input Signals
      9. 6.13.9  Interrupts
        1. 6.13.9.1 External Interrupt (XINT) Electrical Data and Timing
          1. 6.13.9.1.1 External Interrupt Timing Requirements
          2. 6.13.9.1.2 External Interrupt Switching Characteristics
          3. 6.13.9.1.3 External Interrupt Timing
      10. 6.13.10 Low-Power Modes
        1. 6.13.10.1 Clock-Gating Low-Power Modes
        2. 6.13.10.2 Low-Power Mode Wake-up Timing
          1. 6.13.10.2.1 IDLE Mode Timing Requirements
          2. 6.13.10.2.2 IDLE Mode Switching Characteristics
          3. 6.13.10.2.3 IDLE Entry and Exit Timing Diagram
          4. 6.13.10.2.4 STANDBY Mode Timing Requirements
          5. 6.13.10.2.5 STANDBY Mode Switching Characteristics
          6. 6.13.10.2.6 STANDBY Entry and Exit Timing Diagram
          7. 6.13.10.2.7 HALT Mode Timing Requirements
          8. 6.13.10.2.8 HALT Mode Switching Characteristics
          9. 6.13.10.2.9 HALT Entry and Exit Timing Diagram
    14. 6.14 Analog Peripherals
      1. 6.14.1 Block Diagram
      2. 6.14.2 Analog Pins and Internal Connections
      3. 6.14.3 Analog Signal Descriptions
      4. 6.14.4 Analog-to-Digital Converter (ADC)
        1. 6.14.4.1 ADC Configurability
          1. 6.14.4.1.1 Signal Mode
        2. 6.14.4.2 ADC Electrical Data and Timing
          1. 6.14.4.2.1 ADC Operating Conditions
          2. 6.14.4.2.2 ADC Characteristics
          3. 6.14.4.2.3 ADC INL and DNL
          4. 6.14.4.2.4 ADC Input Model
          5. 6.14.4.2.5 ADC Timing Diagrams
      5. 6.14.5 Temperature Sensor
        1. 6.14.5.1 Temperature Sensor Electrical Data and Timing
          1. 6.14.5.1.1 Temperature Sensor Characteristics
      6. 6.14.6 Comparator Subsystem (CMPSS)
        1. 6.14.6.1 CMPx_DACL
        2. 6.14.6.2 CMPSS Connectivity Diagram
        3. 6.14.6.3 Block Diagram
        4. 6.14.6.4 CMPSS Electrical Data and Timing
          1. 6.14.6.4.1 CMPSS Comparator Electrical Characteristics
          2.        CMPSS Comparator Input Referred Offset and Hysteresis
          3. 6.14.6.4.2 CMPSS DAC Static Electrical Characteristics
          4. 6.14.6.4.3 CMPSS Illustrative Graphs
          5. 6.14.6.4.4 Buffered Output from CMPx_DACL Operating Conditions
          6. 6.14.6.4.5 Buffered Output from CMPx_DACL Electrical Characteristics
      7. 6.14.7 Buffered Digital-to-Analog Converter (DAC)
        1. 6.14.7.1 Buffered DAC Electrical Data and Timing
          1. 6.14.7.1.1 Buffered DAC Operating Conditions
          2. 6.14.7.1.2 Buffered DAC Electrical Characteristics
      8. 6.14.8 Programmable Gain Amplifier (PGA)
        1. 6.14.8.1 PGA Electrical Data and Timing
          1. 6.14.8.1.1 PGA Operating Conditions
          2. 6.14.8.1.2 PGA Characteristics
    15. 6.15 Control Peripherals
      1. 6.15.1 Enhanced Pulse Width Modulator (ePWM)
        1. 6.15.1.1 Control Peripherals Synchronization
        2. 6.15.1.2 ePWM Electrical Data and Timing
          1. 6.15.1.2.1 ePWM Timing Requirements
          2. 6.15.1.2.2 ePWM Switching Characteristics
          3. 6.15.1.2.3 Trip-Zone Input Timing
            1. 6.15.1.2.3.1 Trip-Zone Input Timing Requirements
            2. 6.15.1.2.3.2 PWM Hi-Z Characteristics Timing Diagram
      2. 6.15.2 High-Resolution Pulse Width Modulator (HRPWM)
        1. 6.15.2.1 HRPWM Electrical Data and Timing
          1. 6.15.2.1.1 High-Resolution PWM Characteristics
      3. 6.15.3 External ADC Start-of-Conversion Electrical Data and Timing
        1. 6.15.3.1 External ADC Start-of-Conversion Switching Characteristics
        2. 6.15.3.2 ADCSOCAO or ADCSOCBO Timing Diagram
      4. 6.15.4 Enhanced Capture (eCAP)
        1. 6.15.4.1 eCAP Block Diagram
        2. 6.15.4.2 eCAP Synchronization
        3. 6.15.4.3 eCAP Electrical Data and Timing
          1. 6.15.4.3.1 eCAP Timing Requirements
          2. 6.15.4.3.2 eCAP Switching Characteristics
      5. 6.15.5 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 6.15.5.1 eQEP Electrical Data and Timing
          1. 6.15.5.1.1 eQEP Timing Requirements
          2. 6.15.5.1.2 eQEP Switching Characteristics
    16. 6.16 Communications Peripherals
      1. 6.16.1 Modular Controller Area Network (MCAN)
      2. 6.16.2 Inter-Integrated Circuit (I2C)
        1. 6.16.2.1 I2C Electrical Data and Timing
          1. 6.16.2.1.1 I2C Timing Requirements
          2. 6.16.2.1.2 I2C Switching Characteristics
          3. 6.16.2.1.3 I2C Timing Diagram
      3. 6.16.3 Power Management Bus (PMBus) Interface
        1. 6.16.3.1 PMBus Electrical Data and Timing
          1. 6.16.3.1.1 PMBus Electrical Characteristics
          2. 6.16.3.1.2 PMBus Fast Plus Mode Switching Characteristics
          3. 6.16.3.1.3 PMBus Fast Mode Switching Characteristics
          4. 6.16.3.1.4 PMBus Standard Mode Switching Characteristics
      4. 6.16.4 Serial Communications Interface (SCI)
      5. 6.16.5 Serial Peripheral Interface (SPI)
        1. 6.16.5.1 SPI Controller Mode Timings
          1. 6.16.5.1.1 SPI Controller Mode Timing Requirements
          2. 6.16.5.1.2 SPI Controller Mode Switching Characteristics - Clock Phase 0
          3. 6.16.5.1.3 SPI Controller Mode Switching Characteristics - Clock Phase 1
          4. 6.16.5.1.4 SPI Controller Mode Timing Diagrams
        2. 6.16.5.2 SPI Peripheral Mode Timings
          1. 6.16.5.2.1 SPI Peripheral Mode Timing Requirements
          2. 6.16.5.2.2 SPI Peripheral Mode Switching Characteristics
          3. 6.16.5.2.3 SPI Peripheral Mode Timing Diagrams
      6. 6.16.6 Local Interconnect Network (LIN)
      7. 6.16.7 Fast Serial Interface (FSI)
        1. 6.16.7.1 FSI Transmitter
          1. 6.16.7.1.1 FSITX Electrical Data and Timing
            1. 6.16.7.1.1.1 FSITX Switching Characteristics
            2. 6.16.7.1.1.2 FSITX Timings
        2. 6.16.7.2 FSI Receiver
          1. 6.16.7.2.1 FSIRX Electrical Data and Timing
            1. 6.16.7.2.1.1 FSIRX Timing Requirements
            2. 6.16.7.2.1.2 FSIRX Switching Characteristics
            3. 6.16.7.2.1.3 FSIRX Timings
        3. 6.16.7.3 FSI SPI Compatibility Mode
          1. 6.16.7.3.1 FSITX SPI Signaling Mode Electrical Data and Timing
            1. 6.16.7.3.1.1 FSITX SPI Signaling Mode Switching Characteristics
            2. 6.16.7.3.1.2 FSITX SPI Signaling Mode Timings
      8. 6.16.8 Universal Serial Bus (USB)
        1. 6.16.8.1 USB Electrical Data and Timing
          1. 6.16.8.1.1 USB Input Ports DP and DM Timing Requirements
          2. 6.16.8.1.2 USB Output Ports DP and DM Switching Characteristics
  8. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Memory
      1. 7.3.1 Memory Map
        1. 7.3.1.1 Dedicated RAM (Mx RAM)
        2. 7.3.1.2 Local Shared RAM (LSx RAM)
        3. 7.3.1.3 Global Shared RAM (GSx RAM)
        4. 7.3.1.4 Message RAM
      2. 7.3.2 Control Law Accelerator (CLA) Memory Map
      3. 7.3.3 Flash Memory Map
        1. 7.3.3.1 Addresses of Flash Sectors
      4. 7.3.4 Peripheral Registers Memory Map
    4. 7.4  Identification
    5. 7.5  Bus Architecture – Peripheral Connectivity
    6. 7.6  C28x Processor
      1. 7.6.1 Floating-Point Unit (FPU)
      2. 7.6.2 Trigonometric Math Unit (TMU)
      3. 7.6.3 VCRC Unit
    7. 7.7  Control Law Accelerator (CLA)
    8. 7.8  Embedded Real-Time Analysis and Diagnostic (ERAD)
    9. 7.9  Direct Memory Access (DMA)
    10. 7.10 Device Boot Modes
      1. 7.10.1 Device Boot Configurations
        1. 7.10.1.1 Configuring Boot Mode Pins
        2. 7.10.1.2 Configuring Boot Mode Table Options
      2. 7.10.2 GPIO Assignments
    11. 7.11 Security
      1. 7.11.1 Securing the Boundary of the Chip
        1. 7.11.1.1 JTAGLOCK
        2. 7.11.1.2 Zero-pin Boot
      2. 7.11.2 Dual-Zone Security
      3. 7.11.3 Disclaimer
    12. 7.12 Watchdog
    13. 7.13 C28x Timers
    14. 7.14 Dual-Clock Comparator (DCC)
      1. 7.14.1 Features
      2. 7.14.2 Mapping of DCCx Clock Source Inputs
    15. 7.15 Configurable Logic Block (CLB)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 TI Reference Design
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Markings
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     TAPE AND REEL INFORMATION
    2.     TRAY

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PZ|100
  • PTF|128
  • PDT|128
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1 Memory Map

The Memory Map table describes the memory map. See the Memory Controller Module section of the System Control chapter in the TMS320F28P55x Real-Time Microcontrollers Technical Reference Manual.

Table 7-1 Memory Map
MEMORY SIZE (x16) START ADDRESS END ADDRESS CPU1.DMA ACCESS CPU1.CLA1 DATA ACCESS CPU1.CLA1 PROGRAM ACCESS ECC/ Parity SECURITY PART NUMBER
M0 RAM 1024 0x0000_0000 0x0000_03FF - - - ECC - All
M1 RAM 1024 0x0000_0400 0x0000_07FF - - - ECC - All
PIE Vector Table 512 0x0000_0D00 0x0000_0EFF - - - Parity - All
CLAtoCPU MSG RAM 128 0x0000_1480 0x0000_14FF - YES - Parity - All
CPUtoCLA MSG RAM 128 0x0000_1500 0x0000_157F - YES - Parity - All
CLAtoDMA MSG RAM 128 0x0000_1680 0x0000_16FF YES YES - Parity - All
DMAtoCLA MSG RAM 128 0x0000_1700 0x0000_177F YES YES - Parity - All
LS8 RAM - CLA Prog 8192 0x0000_4000 0x0000_5FFF - - YES Parity YES F28P559SJ9-Q1,F28P550SJ9,F28P559SG9-Q1,F28P550SG9,F28P550SG8,F28P559SG8-Q1, F28P559SJ6-Q1,F28P550SJ6
LS9 RAM - CLA Prog 8192 0x0000_6000 0x0000_7FFF - - YES Parity YES F28P559SJ9-Q1,F28P550SJ9,F28P559SG9-Q1,F28P550SG9,F28P550SG8,F28P559SG8-Q1, F28P559SJ6-Q1,F28P550SJ6
LS0 RAM 2048 0x0000_8000 0x0000_87FF - YES YES Parity YES All
LS1 RAM 2048 0x0000_8800 0x0000_8FFF - YES YES Parity YES All
LS2 RAM 2048 0x0000_9000 0x0000_97FF - YES YES Parity YES All
LS3 RAM 2048 0x0000_9800 0x0000_9FFF - YES YES Parity YES All
LS4 RAM 2048 0x0000_A000 0x0000_A7FF - YES YES Parity YES All
LS5 RAM 2048 0x0000_A800 0x0000_AFFF - YES YES Parity YES All
LS6 RAM 2048 0x0000_B000 0x0000_B7FF - YES YES Parity YES All
LS7 RAM 2048 0x0000_B800 0x0000_BFFF - YES YES Parity YES All
GS0 RAM 8192 0x0000_C000 0x0000_DFFF YES - - Parity - All
GS1 RAM 8192 0x0000_E000 0x0000_FFFF YES - - Parity - All
CLA Data ROM 4096 0x0000_F000 0x0000_FFFF - YES - Parity - F28P559SJ9-Q1,F28P550SJ9,F28P559SG9-Q1,F28P550SG9,F28P550SG8,F28P559SG8-Q1, F28P559SJ6-Q1,F28P550SJ6
GS2 RAM 8192 0x0001_0000 0x0001_1FFF YES - - Parity - F28P559SJ9-Q1,F28P550SJ9,F28P559SJ2-Q1,F28P559SJ6-Q1,F28P550SJ6
GS3 RAM 8192 0x0001_2000 0x0001_3FFF YES - - Parity - F28P559SJ9-Q1,F28P550SJ9,F28P559SJ2-Q1, F28P559SJ6-Q1,F28P550SJ6
LS8 RAM - CPU 8192 0x0001_4000 0x0001_5FFF - - - Parity YES F28P559SJ9-Q1,F28P550SJ9,F28P559SG9-Q1,F28P550SG9,F28P559SG8-Q1, F28P559SG2-Q1,F28P559SJ2-Q1, F28P550SG8, F28P559SJ6-Q1,F28P550SJ6
LS9 RAM - CPU 8192 0x0001_6000 0x0001_7FFF - - - Parity YES F28P559SJ9-Q1,F28P550SJ9,F28P559SG9-Q1,F28P550SG9,F28P559SG8-Q1, F28P559SG2-Q1,F28P559SJ2-Q1, F28P550SG8, F28P559SJ6-Q1,F28P550SJ6
USB RAM 2048 0x0004_1000 0x0004_17FF YES - - - - F28P559SJ9-Q1,F28P550SJ9,F28P559SG9-Q1,F28P550SG9, F28P559SJ6-Q1,F28P550SJ6
MCANA Message RAM (CPU Access mode) 2048 0x0005_8000 0x0005_87FF YES - - ECC - All
MCANA Message RAM (Peripheral mode) 4096 0x0005_8000 0x0005_8FFF YES - - ECC - All
MCANB Message RAM (Peripheral mode) 4096 0x0005_A000 0x0005_AFFF YES - - ECC - All
MCANB Message RAM (CPU Access mode) 2048 0x0005_A000 0x0005_A7FF YES - - ECC - All
TI OTP Bank 0 1536 0x0007_2000 0x0007_25FF - - - ECC - All
UID_REGS 6 0x0007_2172 0x0007_2177 - - - ECC - All
TI OTP Bank 1 1536 0x0007_3000 0x0007_35FF - - - ECC - F28P559SJ9-Q1,F28P550SJ9,F28P559SJ2-Q1, F28P559SJ6-Q1,F28P550SJ6
TI OTP Bank 2 1536 0x0007_4000 0x0007_45FF - - - ECC - All
TI OTP Bank 3 1536 0x0007_5000 0x0007_55FF - - - ECC - F28P559SJ9-Q1,F28P550SJ9,F28P559SJ2-Q1, F28P559SJ6-Q1,F28P550SJ6
TI OTP Bank 4 1536 0x0007_6000 0x0007_65FF - - - ECC - F28P559SJ9-Q1, F28P550SJ9, F28P559SJ2-Q1, F28P559SJ6-Q1, F28P550SJ6, F28P559SG9-Q1, F28P550SG9
DCSM BANK0 Z1 OTP 512 0x0007_8000 0x0007_81FF - - - ECC YES All
DCSM BANK0 Z2 OTP 512 0x0007_8200 0x0007_83FF - - - ECC YES All
User OTP Bank 1 1024 0x0007_8800 0x0007_8BFF - - - ECC - F28P559SJ9-Q1,F28P550SJ9,F28P559SJ2-Q1, F28P559SJ6-Q1,F28P550SJ6
User OTP Bank 2 1024 0x0007_9000 0x0007_93FF - - - ECC - All
User OTP Bank 3 1024 0x0007_9800 0x0007_9BFF - - - ECC - F28P559SJ9-Q1,F28P550SJ9,F28P559SJ2-Q1, F28P559SJ6-Q1,F28P550SJ6
User OTP Bank 4 1024 0x0007_A000 0x0007_A3FF - - - ECC - F28P559SG9-Q1, F28P550SG9
Flash Bank 0 131072 0x0008_0000 0x0009_FFFF - - - ECC YES All
Flash Bank 1 131072 0x000A_0000 0x000B_FFFF - - - ECC YES F28P559SJ9-Q1,F28P550SJ9,F28P559SJ2-Q1, F28P559SJ6-Q1,F28P550SJ6
Flash Bank 2 131072 0x000C_0000 0x000D_FFFF - - - ECC YES All
Flash Bank 3 131072 0x000E_0000 0x000F_FFFF - - - ECC YES F28P559SJ9-Q1,F28P550SJ9,F28P559SJ2-Q1, F28P559SJ6-Q1,F28P550SJ6
Flash Bank 4 32768 0x0010_0000 0x0010_7FFF - - - ECC YES F28P559SJ9-Q1, F28P550SJ9,F28P559SJ2-Q1, F28P559SJ6-Q1, F28P550SJ6, F28P559SG9-Q1, F28P550SG9
Z1-SecureBoot Functions 3072 0x003F_4000 0x003F_4BFF - - - Parity YES All
Z1-Safe Functions 1536 0x003F_4C00 0x003F_51FF - - - Parity YES All
Z2-Safe Functions 1536 0x003F_5600 0x003F_5BFF - - - Parity YES All
CPU STL 9216 0x003F_5C00 0x003F_7FFF - - - Parity - All
Boot ROM 32768 0x003F_8000 0x003F_FFFF - - - Parity - All
PIE Vector Table Swap 512 0x0100_0900 0x0100_0AFF - - - Parity - All
CLA Data ROM (CPU Mapped) 4096 0x0100_1000 0x0100_1FFF - - - Parity - F28P559SJ9-Q1,F28P550SJ9,F28P559SG9-Q1,F28P550SG9,F28P550SG8,F28P559SG8-Q1, F28P559SJ6-Q1,F28P550SJ6
TI OTP Bank 0 ECC 192 0x0107_0400 0x0107_04BF - - - - - All
TI OTP Bank 1 ECC 192 0x0107_0600 0x0107_06BF - - - - - F28P559SJ9-Q1,F28P550SJ9,F28P559SJ2-Q1, F28P559SJ6-Q1,F28P550SJ6
TI OTP Bank 2 ECC 192 0x0107_0800 0x0107_08BF - - - - - All
TI OTP Bank 3 ECC 192 0x0107_0A00 0x0107_0ABF - - - - - F28P559SJ9-Q1,F28P550SJ9,F28P559SJ2-Q1, F28P559SJ6-Q1,F28P550SJ6
TI OTP Bank 4 ECC 192 0x0107_0C00 0x0107_0CBF - - - - - F28P559SJ9-Q1, F28P550SJ9, F28P559SJ2-Q1, F28P559SJ6-Q1, F28P550SJ6, F28P559SG9-Q1, F28P550SG9