SPRSP85 April 2024 TMS320F28P550SJ , TMS320F28P559SJ-Q1
ADVANCE INFORMATION
Refer to the PDF data sheet for device specific package drawings
°C/W(1) | ||
---|---|---|
RΘJC | Junction-to-case thermal resistance(top) | 11.6 |
Junction-to-case thermal resistance(bottom) | 1.2 | |
RΘJB | Junction-to-board thermal resistance | 6.7 |
RΘJA (High k PCB) | Junction-to-free air thermal resistance | 23.7 |
PsiJT | Junction-to-package top | 0.1 |
PsiJB | Junction-to-board | 6.7 |