SCDS388B November   2018  – February 2024 TMUX1108

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (VDD = 5V ±10 %)
    6. 6.6  Electrical Characteristics (VDD = 3.3V ±10 %)
    7. 6.7  Electrical Characteristics (VDD = 2.5V ±10 %), (VSS = –2.5V ±10 %)
    8. 6.8  Electrical Characteristics (VDD = 1.8V ±10 %)
    9. 6.9  Electrical Characteristics (VDD = 1.2V ±10 %)
    10. 6.10 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1  On-Resistance
      2. 7.1.2  Off-Leakage Current
      3. 7.1.3  On-Leakage Current
      4. 7.1.4  Transition Time
      5. 7.1.5  Break-Before-Make Delay
      6. 7.1.6  Turn-On and Turn-Off Time
      7. 7.1.7  Charge Injection
      8. 7.1.8  Off Isolation
      9. 7.1.9  Crosstalk
      10. 7.1.10 Bandwidth
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail to Rail Operation
      3. 7.3.3 1.8V Logic Compatible Inputs
      4. 7.3.4 Fail-Safe Logic
      5. 7.3.5 Ultra-low Leakage Current
      6. 7.3.6 Ultra-low Charge Injection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
VDD–VSS Supply voltage –0.5 6 V
VDD –0.5 6 V
VSS –3.0 0.3 V
VSEL or VEN Logic control input pin voltage (EN, A0, A1, A2) –0.5 6 V
ISEL or IEN Logic control input pin current (EN, A0, A1, A2) –30 30 mA
VS or VD Source or drain voltage (Sx, D) –0.5 VDD+0.5 V
IS or ID (CONT) Source or drain continuous current (Sx, D) IDC ± 10 %(4) IDC ± 10 %(4) mA
IS or ID (PEAK) Source and drain peak current: (1 ms period maximum, 10% duty cycle maximum) (Sx, SxA, SxB, D, DA, DB) Ipeak ± 10 %(4) Ipeak ± 10 %(4) mA
Tstg Storage temperature –65 150 °C
Ptot Total power dissipation(5)(6) 500 mW
TJ Junction temperature 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3) All voltages are with respect to ground, unless otherwise specified.
(4) Refer to Recommended Operating Conditions for IDC and IPeak ratings.
(5) For TSSOP package: Ptot derates linearly above TA=90°C by 8.41mW/°C
(6) For QFN package: Ptot derates linearly above TA=82°C by 7.43mW/°C