SCDS419D November   2020  – January 2022 TMUX6208 , TMUX6209

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Thermal Information
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Source or Drain Continuous Current
    6. 7.6  ±15 V Dual Supply: Electrical Characteristics 
    7. 7.7  ±15 V Dual Supply: Switching Characteristics 
    8. 7.8  36 V Single Supply: Electrical Characteristics 
    9. 7.9  36 V Single Supply: Switching Characteristics 
    10. 7.10 12 V Single Supply: Electrical Characteristics 
    11. 7.11 12 V Single Supply: Switching Characteristics 
    12. 7.12 ±5 V Dual Supply: Electrical Characteristics 
    13. 7.13 ±5 V Dual Supply: Switching Characteristics 
    14. 7.14 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  tON(EN) and tOFF(EN)
    6. 8.6  Break-Before-Make
    7. 8.7  tON (VDD) Time
    8. 8.8  Propagation Delay
    9. 8.9  Charge Injection
    10. 8.10 Off Isolation
    11. 8.11 Crosstalk
    12. 8.12 Bandwidth
    13. 8.13 THD + Noise
    14. 8.14 Power Supply Rejection Ratio (PSRR)
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Integrated Pull-Down Resistor on Logic Pins
      5. 9.3.5 Fail-Safe Logic
      6. 9.3.6 Latch-Up Immune
      7. 9.3.7 Ultra-Low Charge Injection
    4. 9.4 Device Functional Modes
    5. 9.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.13 ±5 V Dual Supply: Switching Characteristics 

VDD = +5 V ± 10%, VSS = –5 V ±10%, GND = 0 V (unless otherwise noted) 
Typical at VDD = +5 V, VSS = –5 V, TA = 25℃  (unless otherwise noted)
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
tTRAN Transition time from control input VS = 3 V
RL = 300 Ω, CL = 35 pF
Refer to Transition Time		 25°C 125 250 ns
–40°C to +85°C 280 ns
–40°C to +125°C 305 ns
tON (EN) Turn-on time from enable VS = 3 V
RL = 300 Ω, CL = 35 pF
Refer to Turn-on and Turn-off Time		 25°C 128 245 ns
–40°C to +85°C 278 ns
–40°C to +125°C 305 ns
tOFF (EN) Turn-off time from enable VS = 3 V
RL = 300 Ω, CL = 35 pF
Refer to Turn-on and Turn-off Time		 25°C 300 372 ns
–40°C to +85°C 400 ns
–40°C to +125°C 420 ns
tBBM Break-before-make time delay VS = 3 V,
RL = 300 Ω, CL = 35 pF
Refer to Break-Before-Make		 25°C 50 ns
–40°C to +85°C 1 ns
–40°C to +125°C 1 ns
TON (VDD) Device turn on time
(VDD to output)		 VDD rise time = 1 µs 
RL = 300 Ω, CL = 35 pF
Refer to Turn-on (VDD) Time		 25°C 0.16 ms
–40°C to +85°C 0.17 1 ms
–40°C to +125°C 0.17 1 ms
tPD Propagation delay RL = 50 Ω , CL = 5 pF
Refer to Propagation Delay		 25°C 2 ns
QINJ Charge injection VS = 0 V, CL = 100 pF
Refer to Charge Injection		 25°C 1.2 pC
OISO Off-isolation RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 100 kHz
Refer to Off Isolation		 25°C –82 dB
OISO Off-isolation RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 1 MHz
Refer to Off Isolation		 25°C –62 dB
XTALK Crosstalk RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 100 kHz
Refer to Crosstalk		 25°C –85 dB
XTALK Crosstalk RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 1MHz
Refer to Crosstalk		 25°C –65 dB
BW –3dB Bandwidth (TMUX6208) RL = 50 Ω , CL = 5 pF
VS = 0 V
Refer to Bandwidth		 25°C 28 MHz
BW –3dB Bandwidth (TMUX6209) RL = 50 Ω , CL = 5 pF
VS = 0 V		 25°C 54 MHz
IL Insertion loss RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 1 MHz		 25°C –0.7 dB
ACPSRR AC Power Supply Rejection Ratio VPP = 0.62 V on VDD and VSS
RL = 50 Ω , CL = 5 pF,
f = 1 MHz
Refer to ACPSRR		 25°C –76 dB
THD+N Total Harmonic Distortion + Noise VPP = 5 V, VBIAS = 0 V
RL  =  10 kΩ , CL = 5 pF,
f = 20 Hz to 20 kHz
Refer to THD + Noise		 25°C 0.0017 %
CS(OFF) Source off capacitance VS = 0 V, f = 1 MHz 25°C 18 pF
CD(OFF) Drain off capacitance (TMUX6208) VS = 0 V, f = 1 MHz 25°C 160 pF
CD(OFF) Drain off capacitance (TMUX6209) VS = 0 V, f = 1 MHz 25°C 80 pF
CS(ON), CD(ON) On capacitance (TMUX6208) VS = 0 V, f = 1 MHz 25°C 205 pF
CS(ON), CD(ON) On capacitance (TMUX6209) VS = 0 V, f = 1 MHz 25°C 124 pF