36-V, low-RON, 8:1 precision multiplexer with 1.8-V logic
Product details
Parameters
Package | Pins | Size
Features
- Single Supply Range: 4.5 V to 36 V
- Dual Supply Range: ±4.5 V to ±18 V
- Low On-Resistance: 4 Ω
- Low Charge Injection: 3 pC
- High current support: 300 mA (Maximum)
- –40°C to +125°C Operating Temperature
- 1.8 V Logic Compatible Inputs
- Fail-Safe Logic
- Rail-to-Rail Operation
- Bidirectional Signal Path
- Break-Before-Make Switching
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Description
The TMUX6208 is a precision 8:1, single channel multiplexer featuring low on resistance and charge injection. The TMUX6208 takes one of the eight inputs and connects it to the common output determined by the state of the enable and address pins. The device supports single supply (4.5 V to 36 V), dual supply (±4.5 V to ±18 V), or asymmetric supply (such as VDD = 12 V, VSS = –5 V). The TMUX6208 supports bidirectional analog and digital signals onthe source (Sx) and drain (D) pins ranging from VSS to VDD.
All logic control inputs support logic high levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Section 8.3.4 circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX6208 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX6208 36-V, Low-Ron, 8:1 Precision Multiplexer with 1.8-V Logic datasheet (Rev. A) | Jan. 19, 2021 |
Application note | Dynamically Controlling Signal in a CWD Receive Path for Ultrasound | Jan. 18, 2021 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 16 | View options |
Ordering & quality
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- Qualification summary
- Ongoing reliability monitoring
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Support & training
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