SLVSGL4 September   2023 TPS1HTC30-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
    1. 5.1 Recommended Connections for Unused Pins
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Accurate Current Sense
      2. 8.3.2 Programmable Current Limit
        1. 8.3.2.1 Capacitive Charging
      3. 8.3.3 Inductive-Load Switching-Off Clamp
      4. 8.3.4 Inductive Load Demagnetization
      5. 8.3.5 Full Protections and Diagnostics
        1. 8.3.5.1 Short-Circuit and Overload Protection
        2. 8.3.5.2 Open-Load Detection
        3. 8.3.5.3 Thermal Protection Behavior
        4. 8.3.5.4 Overvoltage (OVP) Protection
        5. 8.3.5.5 UVLO Protection
        6. 8.3.5.6 Reverse Polarity Protection
        7. 8.3.5.7 Protection for MCU I/Os
      6. 8.3.6 Diagnostic Enable Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Working Mode
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Dynamically Changing Current Limit
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Without a GND Network
        2. 9.4.2.2 With a GND Network
        3. 9.4.2.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

TPS1HTC30-Q1 is a single-channel, smart high-side switch, with integrated NMOS power FET and charge pump, designed to meet the requirements of 24-V automotive battery systems. The low RON(30 mΩ) minimizes device power dissipation driving a wide range of output load current up to 6-A DC, and the 60-V DC operating range improves system robustness.

The device integrates protection features such as thermal shutdown, output clamp, and current limit. These features improve system robustness during fault events such as short circuit. TPS1HTC30-Q1 implements an adjustable current limiting circuit that improves the reliability of the system by reducing inrush current when driving large capacitive loads and minimizing overload current. The device also provides an accurate load current sense that allows for improved load diagnostics such as overload and open-load detection enabling better predictive maintenance.

TPS1HTC30-Q1 is available in a small 14-pin, 4.40-mm × 5.0-mm HTSSOP leaded package with 0.65-mm pin pitch minimizing the PCB footprint.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE (NOM)
TPS1HTC30-Q1 PWP (HTSSOP, 14) 6.50 mm × 5.00 mm 4.40 mm × 5.00 mm
For all available packages, see the orderable addendum at the end of the data sheet.
The package size (length x width) is a nominal value and includes pins, where applicable.
GUID-20211203-SS0I-PKRF-H2FW-78QK1MV79NVS-low.svg Typical Application Schematic