SLVSGL4 September   2023 TPS1HTC30-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
    1. 5.1 Recommended Connections for Unused Pins
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Accurate Current Sense
      2. 8.3.2 Programmable Current Limit
        1. 8.3.2.1 Capacitive Charging
      3. 8.3.3 Inductive-Load Switching-Off Clamp
      4. 8.3.4 Inductive Load Demagnetization
      5. 8.3.5 Full Protections and Diagnostics
        1. 8.3.5.1 Short-Circuit and Overload Protection
        2. 8.3.5.2 Open-Load Detection
        3. 8.3.5.3 Thermal Protection Behavior
        4. 8.3.5.4 Overvoltage (OVP) Protection
        5. 8.3.5.5 UVLO Protection
        6. 8.3.5.6 Reverse Polarity Protection
        7. 8.3.5.7 Protection for MCU I/Os
      6. 8.3.6 Diagnostic Enable Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Working Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Dynamically Changing Current Limit
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Without a GND Network
        2. 9.4.2.2 With a GND Network
        3. 9.4.2.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.9 Typical Characteristics

GUID-20221218-SS0I-W6C6-VWM5-TBLL79CF4JTN-low.svg
IOUT= 0. 2 A
Figure 6-3 On-Resistance (RON) vs Temperature vs VS Supply Voltage
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VEN = 5 V VDIAG_EN = 0 V
Figure 6-5 Quiescent Current (IQ, VS) From VS Input Supply vs Temperature vs VS Voltage
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RL= 48 Ω  
Figure 6-7 Turn-on Delay Time (tDR) vs Temperature vs VS Voltage
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RL= 48 Ω  
Figure 6-9 Turn-on Time (tON) vs Temperature vs VS Voltage
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RL= 48 Ω  
Figure 6-11 VOUT Rising Slew Rate (SRR) vs Temperature vs VS Voltage
GUID-20221219-SS0I-F22K-JSDZ-7WVCH6SWZLSR-low.svg
VS = 24 V  
Figure 6-13 Current Sense Ratio (KSNS) vs Temperature vs Load Current
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VS = 24 V
Figure 6-4 On-Resistance (RON) vs Temperature vs Load Current
GUID-20221218-SS0I-SNV1-NZGD-0P6X1RW4QDN6-low.svg
VEN = 0 V VDIAG_EN = 0 V
Figure 6-6 Standby Current (ISTBY, VS) From VS Input Supply vs Temperature vs VS Voltage
GUID-20221218-SS0I-GHQM-D0F1-TT5XPXJKHBQQ-low.svg
RL= 48 Ω  
Figure 6-8 Turn-off Delay Time (tDF) vs Temperature vs VS Voltage
GUID-20221218-SS0I-MN1H-5FCN-Q6FXFRX6FGWB-low.svg
RL= 48 Ω  
Figure 6-10 Turn-off Time (tOFF) vs Temperature vs VS Voltage
GUID-20221218-SS0I-ZQCZ-ND2F-C0ZSXZ9CJPXT-low.svg
RL= 48 Ω  
Figure 6-12 VOUT Rising Slew Rate (SRF) vs Temperature vs VS Voltage