SLVSCO0F
June 2014 – July 2025
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics
6.7
Typical DC Characteristics
6.8
Typical AC Characteristics (TPS22914B/15B)
6.9
Typical AC Characteristics (TPS22914C/15C)
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
On and Off Control
8.3.2
Input Capacitor (CIN)
8.3.3
Output Capacitor (CL)
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
VIN to VOUT Voltage Drop
9.2.2.2
Inrush Current
9.2.3
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.1.1
Thermal Considerations
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Related Links
10.3
Receiving Notification of Documentation Updates
10.4
Support Resources
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
YFP|4
MXBG055R
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvsco0f_oa
slvsco0f_pm
1
Features
Integrated Single Channel Load Switch
Input Voltage Range: 1.05V to 5.5V
Low On-Resistance (R
ON
)
R
ON
= 37mΩ (Typical) at V
IN
= 5V
R
ON
= 38mΩ (Typical) at V
IN
= 3.3V
R
ON
= 43mΩ (Typical) at V
IN
= 1.8V
2A Maximum Continuous Switch Current
Low Quiescent Current
7.7µA (Typical) at V
IN
= 3.3V
Low Control Input Threshold Enables Use of 1V or Higher GPIO
Controlled Slew Rate
t
R
(TPS22914B/15B) = 64µs at V
IN
= 3.3V
t
R
(TPS22914C/15C) = 913µs at V
IN
= 3.3V
Quick Output Discharge (TPS22915 only)
Ultra-Small Wafer-Chip-Scale Package
0.74mm × 0.74mm, 0.4mm Pitch,
0.5mm Height (YFP)
ESD Performance Tested per JESD 22
2kV HBM and 1kV CDM