SLVSDE7C November   2016  – September 2020 TPS22976

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics (VBIAS = 5V)
    6. 7.6  Electrical Characteristics (VBIAS = 2.5V)
    7. 7.7  Switching Characteristics (TPS22976, TPS22976N)
    8. 7.8  Switching Characteristics (TPS22976A)
    9. 7.9  Typical DC Characteristics
    10. 7.10 Typical AC Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ON and OFF Control
      2. 9.3.2 Input Capacitor (Optional)
      3. 9.3.3 Output Capacitor (Optional)
      4. 9.3.4 Quick Output Discharge (QOD) (Not Present in TPS22976N)
      5. 9.3.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Parallel Configuration
      2. 10.1.2 Standby Power Reduction
      3. 10.1.3 Power Supply Sequencing without GPIO Input
      4. 10.1.4 Reverse Current Blocking
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Inrush Current
        2. 10.2.2.2 Adjustable Rise Time
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Power Dissipation
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Developmental Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) TPS22976 UNIT
DPU (WSON)
14 PINS
RθJA Junction-to-ambient thermal resistance 50.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52.3 °C/W
RθJB Junction-to-board thermal resistance 18.4 °C/W
ΨJT Junction-to-top characterization parameter 1.6 °C/W
ΨJB Junction-to-board characterization parameter 18.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.5 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.