SLVSDE7D November   2016  – December 2023 TPS22976

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1.     Pin Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (VBIAS = 5V)
    6. 6.6  Electrical Characteristics (VBIAS = 2.5V)
    7. 6.7  Switching Characteristics (TPS22976)
    8. 6.8  Switching Characteristics (TPS22976A)
    9. 6.9  Switching Characteristics (TPS22976N)
    10. 6.10 Typical DC Characteristics
    11. 6.11 Typical AC Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 ON and OFF Control
      2. 8.3.2 Input Capacitor (Optional)
      3. 8.3.3 Output Capacitor (Optional)
      4. 8.3.4 Quick Output Discharge (QOD) (Not Present in TPS22976N)
      5. 8.3.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Parallel Configuration
      2. 9.1.2 Standby Power Reduction
      3. 9.1.3 Power Supply Sequencing without GPIO Input
      4. 9.1.4 Reverse Current Blocking
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inrush Current
        2. 9.2.2.2 Adjustable Rise Time
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Power Dissipation
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Developmental Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPU|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS22976 UNIT
DPU (WSON)
14 PINS
RθJA Junction-to-ambient thermal resistance 50.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52.3 °C/W
RθJB Junction-to-board thermal resistance 18.4 °C/W
ΨJT Junction-to-top characterization parameter 1.6 °C/W
ΨJB Junction-to-board characterization parameter 18.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.