SLVS850A June   2008  – September 2023 TPS2551-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configurations and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Overcurrent
      2. 8.3.2 Reverse-Voltage Protection
      3. 8.3.3 FAULT Response
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Enable (EN)
      6. 8.3.6 Thermal Sense
      7. 8.3.7 Device Functional Modes
    4. 8.4 Programming
      1. 8.4.1 Programming the Current-Limit Threshold
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Two-Level Current-Limit Circuit
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detail Design Procedure
        1. 9.2.3.1 Designing Above a Minimum Current Limit
        2. 9.2.3.2 Designing Below a Maximum Current Limit
        3. 9.2.3.3 Input and Output Capacitance
      4. 9.2.4 Auto-Retry Functionality
      5. 9.2.5 Latch-Off Functionality
      6. 9.2.6 Typical Application as USB Power Switch
        1. 9.2.6.1 Design Requirements
          1. 9.2.6.1.1 USB Power-Distribution Requirements
        2. 9.2.6.2 Detail Design Procedure
          1. 9.2.6.2.1 Universal Serial Bus (USB) Power-Distribution Requirements
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Self-Powered and Bus-Powered Hubs
      2. 9.3.2 Low-Power Bus-Powered and High-Power Bus-Powered Functions
      3. 9.3.3 Power Dissipation and Junction Temperature
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

  • TI recommends placing the 100-nF bypass capacitor near the IN and GND pins, and make the connections using a low-inductance trace.
  • TI recommends placing a high-value electrolytic capacitor and a 100-nF bypass capacitor on the output pin when large transient currents are expected on the output.
  • The traces routing the RILIM resistor to the device must be as short as possible to reduce parasitic effects on the current limit accuracy.
  • The PowerPAD must be directly connected to PCB ground plane using wide and short copper trace.